Research Progress on Infrared Detection Materials and Devices of HgCdTe Multilayer Heterojunction
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摘要: HgCdTe多层异质结技术是未来主流红外探测器发展的重要技术方向,在高工作温度、双/多色和雪崩光电管等高性能红外探测器中扮演着重要的角色。近年来基于多层异质结构的HgCdTe高工作温度红外探测器得到了快速发展,尤其是以势垒阻挡型和非平衡工作P+-π(ν)-N+结构为主的器件受到了广泛的研究。本文系统介绍了势垒阻挡型和非平衡工作P+-π(ν)-N+结构HgCdTe红外探测器的暗电流抑制机理,分析了制约两种器件结构发展的关键问题,并对国内外的研究进展进行了综述。对多层异质结构HgCdTe红外探测器的发展进行了总结与展望。Abstract: The HgCdTe multilayer heterojunction technology is an important direction for the development of mainstream infrared detectors in the future, playing an important role in high-performance infrared detectors, such as high operating temperature (HOT) detectors, dual/multicolor detectors, and avalanche photodiodes (APDs). Recently, HgCdTe HOT infrared detectors based on multilayer heterojunction technology have been developed, particularly devices based on the barrier and non-equilibrium operating P+-π(ν)-N+ structure have been widely studied. In this review, the dark current suppression mechanisms of P+-π(ν)-N+ structure HgCdTe infrared detectors with barrier and non-equilibrium operations were systematically introduced, the key problems that restrict the development of these two types of devices were analyzed, and the relevant research progress was reviewed. We summarized and assessed the prospects of the development of multilayer heterojunction HgCdTe infrared detectors.
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Key words:
- HgCdTe /
- multilayer heterojunction /
- barrier /
- non-equilibrium operating /
- focal plane arrays device
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图 1 单极势垒型红外探测器:(a)~(e)分别为nBn器件的能带结构[28]、Arrhenius曲线特性[28]、暗电流抑制特性[30]、体能带结构与表面能带结构对比[31]和表面漏电流通道的阻挡[31];(f) nBn焦平面器件阵列结构[32]
Figure 1. Unipolar barrier infrared detector: (a)-(e) are the band structure[28], Arrhenius curve characteristics[28], dark current suppression characteristics[30], comparison of bulk band structure and surface band structure[31], and blocking of surface leakage current channel of nBn device[31], respectively; (f) nBn focal plane array structure[32]
图 2 HgCdTe势垒型探测器:(a)和(b)分别为nBn探测器的能带结构和暗电流的Arrhenius曲线[39-40];(c)和(d)分别为互补势垒探测器NBνN的能带结构和暗电流的Arrhenius曲线[41];(e)和(f)分别为p型掺杂势垒的能带结构和J-V特性曲线[48]
Figure 2. HgCdTe barrier detector: (a) and (b) are the band structure and Arrhenius curve of dark current of nBn detector, respectively[39-40]; (c) and (d) are the band structure and the Arrhenius curve of dark current of the complementary barrier detector NBνN, respectively[41]; (e) and (f) are the band structure and J-V characteristic curves of p-type doping barrier, respectively[48]
图 3 HgCdTe势垒型探测器降低ΔEv的方法:(a)和(b)分别为HgTe/CdTe能带对准示意图和超晶格势垒能带结构图[55];(c)和(d)分别为势垒层两端的x组分梯度和n型/p型掺杂梯度[56];(e)和(f)分别为势垒层两端δ掺杂调控结构和能带结构[57]
Figure 3. The solutions of reduce ΔEv of HgCdTe barrier detector: (a) and (b) are HgT/CdTe band alignment diagram and superlattice barrier band diagram, respectively[55]; (c) and (d) are Cd molar fraction gradient and acceptor/donor doping gradient at both ends of the barrier layer, respectively[56]; (e) and (f) are δ-doping regulatory structures and band structures at both ends of the barrier layer, respectively[57]
图 4 HgCdTe P+-π-N+单元红外探测器:(a)和(b)为非平衡工作器件结构及暗电流曲线[64];(c)-(f)分别为零偏及反偏时的能带结构[71]、反偏时的频率响应特性[70]、多层异质单元器件结构和器件封装形式[52]
Figure 4. HgCdTe P+-π-N+ prototype infrared detector: (a) and (b) are the structure and dark current curve of non-equilibrium operating device; (c)-(f) are the band structures with and without reverse bias[70], the frequency response characteristics with reverse bias[70], the structure and packaging form of multilayer heterojunction prototype devices[52], respectively
图 5 P/p(π)/N结构焦平面红外探测器:(a)和(b)分别为P+-p-N+探测器的像元结构[17]和掺杂以及组分变化曲线[82];(c)-(f)分别为P+-p-N+焦平面探测器的焦平面阵列结构[17]、NETD曲线[85]、210 K时的成像效果图[85]和探测器组件产品图[91]
Figure 5. Focal plane array infrared detectors with P/p(π)/N structure: (a) and (b) are the pixel structure[17], doping and composition change curves of P+-p-N+ detectors[82], respectively; (c)-(f) are FPAs structure[17], calculated and measured NETD[85], hawk image at 210 K[85] and component product of P+-p-N+ FPAs detector[91], respectively
图 6 P-ν-N结构焦平面红外探测器:(a)和(b)分别为吸收层Auger抑制高于“07规则”和完全耗尽时的能带结构图[94];(c) P-ν-N焦平面结构及其特征[63];(d) ν吸收区的暗电流密度随着多子(电子)浓度降低而降低并直达BLIP[63];(e) ν吸收层掺杂水平对全耗尽时所需反向偏压的影响[13];(f)不同波长时全耗尽HgCdTe P-ν-N焦平面探测器工作温度的提升[97]
Figure 6. Focal plane infrared detector of P-ν-N structure: (a) and (b) are the band structures of absorption layer with Auger suppression higher than "07 rule" and complete depletion, respectively[94]; (c) P-ν-N focal plane array structure and its characteristics[63]; (d) The dark current density in the absorption region decreases with the decrease of the majority carrier (electron) concentration and reaches the background limit infrared performance[63]; (e) The effect of doping level of the absorption layer on required reverse bias voltage when full depletion[13]; (f) Increases of operating temperature of full depletion HgCdTe P-ν-N focal plane detector with different wavelength[97]
表 1 势垒阻挡型HgCdTe红外探测器的结构及性能对比
Table 1. Comparisons of structure and performance of barrier blocking HgCdTe infrared detectors
Device structure λcut-off/
μmT/K Dark current
Vbias=−0.2 V
(A/cm2)Other
performanceResearch institution Year Ref. nBnn 5.7 77 −0.54@180 K and −0.8 V Qη=66%
Vturn on=−0.5~−1.0 VUMich, USA 2011 [39] nBnnN 5.2 77 3.74×10-6@−0.5 V Vturn on=−0.2 V 2012 [41] $ {\mathrm{p}}^{+}{\mathrm{B}}_{\mathrm{p}}{\mathrm{n}\mathrm{N}}^{+} $ 3.6 230 (2~3)×10-4 Ri=2 A/W MUT/Vigo, Poland 2014 [47] $ {\mathrm{p}}^{+}{\mathrm{B}}_{\mathrm{p}}{\mathrm{p}\mathrm{N}}^{+} $ $ {\mathrm{n}\mathrm{B}}_{\mathrm{p}}\mathrm{p}{\mathrm{N}}^{+} $ 3.6 230 (2~3)×10-2 D*=2.0×1010Jones MUT/Vigo, Poland 2015 [50] $ {\mathrm{n}\mathrm{B}}_{\mathrm{p}}\mathrm{n}{\mathrm{N}}^{+} $ (7~60)×10-2 D*=1.0×1010 Jones $ {{\mathrm{n}}^{+}\mathrm{B}}_{\mathrm{p}}\mathrm{p}{\mathrm{N}}^{+} $ (1~3)×10-1 D*=8.0×109 Jones $ {{\mathrm{n}}^{+}\mathrm{B}}_{\mathrm{p}}\mathrm{n}{\mathrm{N}}^{+} $ > 1.0 D*=1.0×109 Jones $ {\mathrm{P}\mathrm{B}}_{\mathrm{p}}\mathrm{\pi }{\mathrm{n}}^{+} $ 9.0 77 (3~4)×10-4 - MUDT, China 2016 [58] $ {\mathrm{p}}^{+}{\mathrm{B}}_{\mathrm{p}}{\mathrm{n}\mathrm{N}}^{+} $ 6.0 230 9×10-2 - MUT, Poland 2016 [26] $ {\mathrm{p}}^{+}{\mathrm{B}}_{\mathrm{p}}{\mathrm{p}\mathrm{N}}^{+} $ 0.1 - $ {\mathrm{n}}^{+}{\mathrm{p}}^{+}{\mathrm{B}}_{\mathrm{p}}\pi {\mathrm{N}}^{+} $ 9.0 230 (8~9)@77 K - MUT/Vigo, Poland 2016 [59] nBnn 7.5 180 ~3.0×10-4 D*=1.64×109 Jones SITP, CAS, China/MUT, Poland 2020 [60] 表 2 HgCdTe多层异质结快速响应单元红外探测器性能对比
Table 2. Comparisons of performances of HgCdTe multilayer heterojunction fast response infrared detectors
Device structure λcut-off
/μmT/K Dark current/(A/cm2) Other performances Year Ref. P-π-N 7.5 230 0.4-2.0@−0.8 V Ri=6 A/W 2013 [72] n+-p+-P+-π-N+ 10.6 230 0.052@−0.2 V - 2016 [77] n+-P+-π-N+ 10.6 230 0.1-0.2@−0.7 V - 2017 [79] 3-20@unbiased - n+-P+-p-N+ 10.6 230 0.1-0.2@−0.7 V - 2017 [70] 4-8@unbiased - < 1@unbiased, optimal D*≈109 Jones n+-P+-p-N+ 10.6 300 ≤1@unbiased, RS+=0 Ω D*≈109 Jones 2017 [80] ~2.3@unbiased, RS+=5-10 Ω - N+-p-P+ 11.6 200 0.1-0.2@unbiased, NA/ni=10, tabs=1 μm Ri=~2 A/W 2018 [74] 表 3 HgCdTe多层异质结焦平面红外探测器性能对比
Table 3. Comparison of performances of HgCdTe multilayer heterojunction FPAs infrared detectors
Device structure FPA
formatλcut-off/
μmNETD/mK Other performance Research institution Year Ref. P+-P-π-N-N+ Variable mesa 320×256
(30 μm)4@150 K 12@180 K - BAE/
QinetiQ, UK2003 [84] Eagle 640×512
(24 μm)9.6@80 K 20@80 K Operability
≥99%Selex, UK 2007 [82] P-p-N
(Hawk)640×512
(16 μm)8.0~9.4 28@80 K Operability =99.6% 2009 [88] P-p-N
(Hawk)640×512
(16 μm)5.5@80 K ~16@160 K
~32@185 K- 2011 [85] P-p-N
(Test array)- - ~18@180 K - 2012 [90] P+-p-N+ (SuperHawk) 1280×1024
(8 μm)- ~24@140 K
~28@ 150 K
~52@ 160 KOperability
≥99%2016 [92] P-ν-N 128×128
1280×480
640×5125.9@250 K
10.2@78 K- MWIR HOT: 250 K
LWIR HOT:
160 KTIS, USA 2018
2020[97]
[94] -
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