Material Removal Property in Double-sided Polishing Process for Microchannel Plates
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引用本文: | 张洋, 黄永刚, 刘辉, 王云, 吕学良. 微通道板双面抛光过程材料去除特性研究[J]. 红外技术, 2014, (4): 336-342. |
Citation: | ZHANG Yang, HUANG Yong-gang, LIU Hui, WANG Yun, LYU Xue-liang. Material Removal Property in Double-sided Polishing Process for Microchannel Plates[J]. Infrared Technology , 2014, (4): 336-342. |