Citation: | JIANG Xianyan, CONG Shuren, NING Zhuo, QI Wenbin, LIU Yan, SONG Linwei, KONG Jincheng. Surface Processing of Cadmium Zinc Telluride Substrates[J]. Infrared Technology , 2023, 45(11): 1242-1255. |
[1] |
陈家骏, 邹凯, 徐由兵, 等. 直拉单晶硅生长过程中的控氧技术研究及标准[J]. 中国标准化, 2017(4): 242-243. https://www.cnki.com.cn/Article/CJFDTOTAL-ZGBZ201704199.htm
CHEN Jiajun, ZOU Kai, XU Youbing, et al. Research and standards on oxygen control technology during the growth process of Czochralski monocrystalline silicon[J]. China Standardization, 2017(4): 242-243. https://www.cnki.com.cn/Article/CJFDTOTAL-ZGBZ201704199.htm
|
[2] |
程愉悻. 单晶硅生长技术的发展分析[J]. 科技创新与应用, 2015(31): 47. https://www.cnki.com.cn/Article/CJFDTOTAL-CXYY201531031.htm
CHENG Yuxing. Development analysis of single crystal silicon growth technology[J]. Technology Innovation and Application, 2015(31): 47. https://www.cnki.com.cn/Article/CJFDTOTAL-CXYY201531031.htm
|
[3] |
郭亚葳. 大尺寸区熔单晶硅生长过程的数值模拟[D]. 北京: 北京有色金属研究总院, 2021.
GUO Yawei. Numerical Simulation of the Growth Process of Large Diameter Silicon Single Crystal by The Floating Zone Melting Method[D], Beijing: General Research Institute for nonferrous Metals, 2021.
|
[4] |
年夫雪. 单晶硅直拉法生长工艺的数值模拟[D]. 上海: 上海大学, 2017.
NIAN Fuxue. Numerical Simulation of Czochralski Single Silicon Crystal Growth Process[D]. Shanghai: Shanghai University, 2017.
|
[5] |
杨翠. 直拉单晶硅生长过程中固液界面形状研究[J]. 内蒙古石油化工, 2017, 43(10): 10-14. https://www.cnki.com.cn/Article/CJFDTOTAL-NMSH201710005.htm
YANG Cui. Study on the shape between solid-liquid boundary surface in growth process of Czochralski monocrystalline silicon[J]. Inner Mongolia Petrochemical Industry, 2017, 43(10): 10-14. https://www.cnki.com.cn/Article/CJFDTOTAL-NMSH201710005.htm
|
[6] |
张怡. 直拉单晶硅生长和工艺研究[J]. 企业导报, 2015(22): 2. https://www.cnki.com.cn/Article/CJFDTOTAL-QYDB201522043.htm
ZHANG Yi. Research on growth and process of Czochralski single crystal silicon[J]. Guide to Business, 2015(22): 2. https://www.cnki.com.cn/Article/CJFDTOTAL-QYDB201522043.htm
|
[7] |
侯保江, 安亚青, 水涌涛, 等. 单晶硅晶片化学机械抛光基本特性研究[J]. 兵器装备工程学报, 2019, 40(6): 163-166. https://www.cnki.com.cn/Article/CJFDTOTAL-CUXI201906034.htm
HOU Baojiang, AN Yaqing, SHUI Yongtao, et al. Research on the basic characteristics of chemical mechanical polishing of single crystal silicon wafers[J]. Journal of Ordnance Equipment Engineering, 2019, 40(6): 163-166. https://www.cnki.com.cn/Article/CJFDTOTAL-CUXI201906034.htm
|
[8] |
李岩. 碲锌镉晶体研磨与磨削的试验研究[D]. 大连: 大连理工大学, 2008.
LI Yan. Experimental Studies on Lapping and Grinding of CdZnTe Crystal[D]. Dalian: Dalian University of Technology, 2008.
|
[9] |
孟耀武. 软脆晶体碲锌镉超精密磨抛的试验研究[D]. 大连: 大连理工大学, 2010.
MENG Yaowu. Experimental Investigations of Ultra-Precision Grinding and Polishing of Soft-Brittle Cadmium Zinc Telluride Single Crystals[D]. Dalian: Dalian University of Technology, 2010.
|
[10] |
孙士文. 碲锌镉单晶生长与晶体质量研究[D]. 上海: 中国科学院研究生院(上海技术物理研究所), 2014.
SUN Shiwen. Growth and Characterization of CdZnTe Single Crystals[D]. Shanghai: University of Chinese Academy of Science (Shanghai Institute of Technical Physics), 2014.
|
[11] |
王可. 碲锌镉晶体基片抛光工艺的实验研究[D]. 大连: 大连理工大学, 2008.
WANG Ke. An Experimental Study of the Polishing Process for CZT Crystal[D]. Dalian: Dalian University of Technology, 2008.
|
[12] |
徐超. 碲锌镉晶体缺陷的物理性能和抑制技术的研究[D]. 上海: 中国科学院大学(中国科学院上海技术物理研究所), 2018.
XU Chao. Study on Physical Properties and Suppression Techniques of CdZnTe Defects[D]. Shanghai: University of Chinese Academy of Science (Shanghai Institute of Technical Physics), 2018.
|
[13] |
周昌鹤. 碲锌镉材料缺陷评价技术及VGF生长技术的研究[D]. 上海: 中国科学院大学(中国科学院上海技术物理研究所), 2021.
ZHOU Changhe. Study on Defect Evaluation and VGF Growth Technique of CdZnTe Materials[D]. Shanghai: University of Chinese Academy of Science (Shanghai Institute of Technical Physics), 2021.
|
[14] |
Capper P. Bulk crystal growth of electronic, optical and optoelectronic materials[M]. New Jersey: John Wiley & Sons In., 2005.
|
[15] |
孙士文, 周昌鹤, 徐超, 等. 碲锌镉衬底研究进展[C]//2015年红外、遥感技术与应用研讨会暨交叉学科论坛论文集, 2015: 82-90.
SUN Shiwen, ZHOU Changhe, XU Chao, et al. Research progress in tellurium zinc cadmium substrate[C]//Proceedings of the 2015 Symposium on Infrared and Remote Sensing Technology and Applications, 2015: 82-90.
|
[16] |
Capper P, Garland J. Mercury Cadmium Telluride (growth, properties and applications)[M]. New Jersey: John Wiley & Sons Inc, 2010.
|
[17] |
Benson J D, Bubulac L O, Jaime Vasquez M, et al. Impact of CdZnTe substrates on MBE HgCdTe deposition[J]. Journal of Electronic Materials, 2017, 46(9): 5418-5423. DOI: 10.1007/s11664-017-5599-1
|
[18] |
Asici B, Eroglu H C, Ergunt Y, et al. CdZnTe substrate surface preparation technology at ASELSAN, Inc. for molecular beam epitaxy growth of high quality HgCdTe epilayers[J]. Journal of Electronic Materials, 2018, 47(10): 5735-5741. DOI: 10.1007/s11664-018-6390-7
|
[19] |
Singh R, Velicu S, Crocco J, et al. Molecular beam epitaxy growth of high-quality HgCdTe LWIR layers on polished and repolished CdZnTe substrates[J]. Journal of Electronic Materials, 2005, 34(6): 885-890. DOI: 10.1007/s11664-005-0037-1
|
[20] |
程雨, 李春领, 肖钰. 碲锌镉晶体表面磨抛方法研究[J]. 红外, 2018, 39(11): 11-16. https://www.cnki.com.cn/Article/CJFDTOTAL-HWAI201811003.htm
CHENG Yu, LI Chunling, XIAO Yu. Study of surface lapping and polishing methods of cadmium zinc telluride[J]. Infrared, 2018, 39(11): 11-16. https://www.cnki.com.cn/Article/CJFDTOTAL-HWAI201811003.htm
|
[21] |
郜培丽. 新型磨粒的制备及其在CZT晶体CMP加工中的应用研究[D]. 大连: 大连理工大学, 2021.
GAO Peili. Preparation of Novel Abrasives and Their Applications in Chemical Mechanical Polishing for Cadmium Zinc Telluride Substrates[D]. Dalian: Dalian University of Technology, 2021.
|
[22] |
彭兰, 王林军, 闵嘉华, 等. 碲锌镉晶片机械研磨和机械抛光工艺研究[J]. 功能材料, 2011, 42(5): 880-887. https://www.cnki.com.cn/Article/CJFDTOTAL-GNCL201105029.htm
PENG Lan, WANG Linjun, MIN Jiahua, et al. Investigation on the mechanical lapping and polishing of CdZnTe wafers[J]. Journal of Functional Materials, 2011, 42(5): 880-887. https://www.cnki.com.cn/Article/CJFDTOTAL-GNCL201105029.htm
|
[23] |
毛晓辰, 朱丽慧, 虞慧娴, 等. 板片状Al2O3磨料对碲锌镉晶体机械研磨的影响[J]. 人工晶体学报, 2018, 47(2): 261-266. https://www.cnki.com.cn/Article/CJFDTOTAL-RGJT201802005.htm
MAO Xiaochen, ZHU Lihui, YU Huixian, et ai. Effect of plate-like Al2O3 abrasives on mechanical lapping of CdZnTe crystals[J]. Journal of Synthetic Crystals, 2018, 47(2): 261-266. https://www.cnki.com.cn/Article/CJFDTOTAL-RGJT201802005.htm
|
[24] |
Crocco J, ZHENG Q, Bensalah H, et al. Detector surface preparation of Cd0.9Zn0.1Te for electrode patterning[J]. Applied Surface Science, 2012, 258(7): 2948-2952. DOI: 10.1016/j.apsusc.2011.11.014
|
[25] |
苑泽伟. 利用化学和机械协同作用的CVD金刚石抛光机理与技术[D]. 大连: 大连理工大学, 2012.
YUAN Zewei. Mechanism and Technology for Polishing CVD Diamond with Chemical and Mechanical Synergistic Effects[D]. Dalian: Dalian University of Technology, 2012.
|
[26] |
高梅. 超精密平面研磨加工压力对精度的影响[J]. 机床与液压, 2008, 36(3): 18-20. https://www.cnki.com.cn/Article/CJFDTOTAL-JCYY200803007.htm
GAO Mei. Effect of process pressure on accuracy in ultra-pricision plane grinding[J]. Machine Tool & Hydraulics, 2008, 36(3): 18-20. https://www.cnki.com.cn/Article/CJFDTOTAL-JCYY200803007.htm
|
[27] |
Brovko A, Adelberg A, Chernyak L, et al. Impact of polishing on crystallinity and static performance of Cd1−xZnxTe[J]. Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2020, 984: 164568. DOI: 10.1016/j.nima.2020.164568
|
[28] |
魏昕, 熊伟, 黄蕊慰, 等. 化学机械抛光中抛光垫的研究[J]. 金刚石与磨料磨具工程, 2004(5): 40-43. https://www.cnki.com.cn/Article/CJFDTOTAL-JGSM201202019.htm
WEI Xin, XIONG Wei, HUANG Ruiwei, et al. Study on the performance of polishing pad in chemical-mechanical polishing[J]. Diamond & Abrasives Engineering, 2004(5): 40-43. https://www.cnki.com.cn/Article/CJFDTOTAL-JGSM201202019.htm
|
[29] |
曹威, 邓朝晖, 李重阳, 等. 化学机械抛光垫的研究进展[J]. 表面技术, 2022, 51(7): 27-41. https://www.cnki.com.cn/Article/CJFDTOTAL-BMJS202207003.htm
CAO Wei, DENG Zhaohui, LI Chongyang, et al. Polishing pad in chemical mechanical polishing[J]. Surface Technology, 2022, 51(7): 27-41. https://www.cnki.com.cn/Article/CJFDTOTAL-BMJS202207003.htm
|
[30] |
Pelenc D, Merlin J, Etcheberry A, et al. Development of a method for chemical-mechanical preparation of the surface of CdZnTe substrates for HgCdTe-based infrared focal-plane arrays[J]. Journal of Electronic Materials, 2014, 43(8): 3004-3011.
|
[31] |
李岩, 康仁科, 高航, 等. 碲锌镉晶体高效低损伤CMP工艺研究[J]. 人工晶体学报, 2009, 38(2): 416-421. https://www.cnki.com.cn/Article/CJFDTOTAL-RGJT200902031.htm
LI Yan, KANG Renke, GAO Hang, et al. High-efficiency and low-damage chemical mechanical polishing process of CdZnTe crystals[J]. Journal of Synthetic Crystals, 2009, 38(2): 416-421. https://www.cnki.com.cn/Article/CJFDTOTAL-RGJT200902031.htm
|
[32] |
敖孟寒, 朱丽慧, 孙士文. 碲锌镉晶体化学机械抛光液的研究[J]. 红外技术, 2017, 39(1): 22-26. http://hwjs.nvir.cn/article/id/hwjs201701004
AO Menghan, ZHU Lihui, SUN Shiwen. Research on chemical-mechanical polishing slurry for CdZnTe crystal[J]. Infrared Technology, 2017, 39(1): 22-26. http://hwjs.nvir.cn/article/id/hwjs201701004
|
[33] |
刘瑞鸿. 二氧化硅介质层CMP抛光液研制及其性能研究[D]. 大连: 大连理工大学, 2009.
LIU Ruihong. Development of SiO2 ILD chemical mechanical polishing slurry and its performance analysis[D]. Dalian: Dalian University of Technology, 2009.
|
[34] |
张振宇, 郭东明, 康仁科, 等. 软脆功能晶体碲锌镉化学机械抛光[J]. 机械工程学报, 2008, 44(12): 215-220. https://www.cnki.com.cn/Article/CJFDTOTAL-JXXB200812036.htm
ZHANG Zhenyu, GUO Dongming, KANG Renke, et al. Chemical mechanical polishing research of CdZnTe functional crystalline with soft brittle nature[J]. Journal of Mechanical Engineering, 2008, 44(12): 215-220. https://www.cnki.com.cn/Article/CJFDTOTAL-JXXB200812036.htm
|
[35] |
ZHANG Z, WANG B, ZHOU P, et al. A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers[J]. Scientific Reports, 2016(6): 26891.
|
[36] |
敖孟寒, 朱丽慧, 孙士文, 等. CZT晶体用化学机械抛光液的制备及其性能研究[J]. 红外, 2015, 36(5): 8-20. https://www.cnki.com.cn/Article/CJFDTOTAL-HWAI201505002.htm
AO Menghan, ZHU Lihui, SUN Shiwen, et al. Research on chemical-mechanical planarization slurry of CdZnTe[J]. Infrared, 2015, 36(5): 8-20. https://www.cnki.com.cn/Article/CJFDTOTAL-HWAI201505002.htm
|
[37] |
Hossain A, Bolotnikov A E, Camarda G S, et al. Novel approach to surface processing for improving the efficiency of CdZnTe detectors[J]. Journal of Electronic Materials, 2013, 43(8): 2771-2777.
|
[38] |
James Ralph B, Gnatyuk V A, Vlasenko O I, et al. Surface processing of CdZnTe crystals[C]//Proceeding of SPIE, 2012, 8507: 85071S.
|
[39] |
ZHENG Q, Dierre F, Crocco J, et al. Influence of surface preparation on CdZnTe nuclear radiation detectors[J]. Applied Surface Science, 2011, 257(20): 8742-8746.
|
[40] |
Moravec P, Höschl P, Franc J, et al. Chemical polishing of CdZnTe substrates fabricated from crystals grown by the vertical-gradient freezing method[J]. Journal of Electronic Materials, 2006, 35: 1206-1213.
|
[41] |
WANG Xiaoqin, JIE Wanqi, LI Qiang, et al. Surface passivation of CdZnTe wafers[J]. Materials Science in Semiconductor Processing, 2005, 8(6): 615-621.
|
[42] |
Ivanits'ka V G, Moravec P, Franc J, et al. Chemical polishing of CdTe and CdZnTe in iodine-methanol etching solutions[J]. Journal of Electronic Materials, 2011, 40(8): 1802-1808.
|
[43] |
侯晓敏, 张瑛侠, 巩锋. 软脆碲锌镉衬底的新型化学抛光技术研究[J]. 激光与红外, 2018, 48(10): 1264-1267. https://www.cnki.com.cn/Article/CJFDTOTAL-JGHW201810013.htm
HOU Xiaomin, ZHANG Yingxia, GONG Feng. Study of new chemical polishing technology for soft-brittle CdZnTe substrates[J]. Laser & Infrared, 2018, 48(10): 1264-1267. https://www.cnki.com.cn/Article/CJFDTOTAL-JGHW201810013.htm
|
[44] |
张银霞, 郜伟, 康仁科, 等. 单晶硅片磨削损伤的透射电子显微分析[J]. 半导体学报, 2008, 29(8): 1552-1556. https://www.cnki.com.cn/Article/CJFDTOTAL-BDTX200808027.htm
ZHANG Yinxia, GAO Wei, KANG Renke, et al. TEM observation on the ground damage of monocrystalline silicon wafers[J]. Journal of Semiconductors, 2008, 29(8): 1552-1556. https://www.cnki.com.cn/Article/CJFDTOTAL-BDTX200808027.htm
|
[45] |
Puttick K E, Whitmore L C, CHAO C L, et al. Transmission electron microscopy of nanomachined silicon crystals[J]. Philosophical Magazine, 1994, 69(1): 91-103.
|
[46] |
Shibata Takayuki, Ono Atsushi. Cross-section transmission electron microscope observations of diamond-turned single-crystal Si[J]. Applied Physics Letters, 1994, 65(20): 2553-2553.
|
[47] |
LI Yan, KANG Renke, GAO Hang, et al. Damage mechanisms during lapping and mechanical polishing CdZnTe wafers[J]. Rare Metals, 2010, 29(3): 276-279.
|
[48] |
Nakagawa K, Maeda K, Takeuchi S. Observation of dislocations in cadmium telluride by cathodoluminescence microscopy[J]. Applied Physics Letters, 1979, 34(9): 574-575.
|
[49] |
Everson W J, Ard C K, Sepich J L, et al. Etch pit characterization of CdTe and CdZnTe substrates for use in mercury cadmium telluride epitaxy[J]. Journal of Electronic Materials, 1995, 24(5): 505-510.
|
[50] |
Teague Lucile C, Duff Martine C, Cadieux James R, et al. Characterization of etch pit formation via the everson-etching method on CdZnTe crystal surfaces from the bulk to the nanoscale[J]. Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2011, 652(1): 178-182.
|
[51] |
周昌鹤, 杨建荣, 周梅华, 等. (112)B碲锌镉衬底表面Everson腐蚀坑与材料缺陷的关系[J]. 红外与毫米波学报, 2021, 40(4): 432-438. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYH202104003.htm
ZHOU Changhe, YANG Jiangrong, ZHOU Meihua, et al. Correlation between everson etch pits and material defects of (112)B CdZnTe substrates[J]. Journal of Infrared and Millimeter Waves, 2021, 40(4): 432-438. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYH202104003.htm
|
[52] |
Inoue Morio, Teramoto Iwao, Takayanagi Shigetoshi. Etch pits and polarity in CdTe crystals[J]. Journal of Applied Physics, 1962, 33(8): 2578-2582.
|
[53] |
郎艳菊. CZT晶体加工表面/亚表面损伤研究[D]. 大连: 大连理工大学, 2008.
LANG Yanju. Surface/subsurface Damage of the Machined CZT Crystal[D]. Dalian: Dalian University of Technology, 2008.
|
[1] | CHEN Zhuang, HE Feng, HONG Xiaohang, ZHANG Qiran, YANG Yuyan. Embedded Platform IR Small-target Detection Based on Self-attention and Convolution Fused Architecture[J]. Infrared Technology , 2025, 47(1): 89-96. |
[2] | DI Jing, LIANG Chan, REN Li, GUO Wenqing, LIAN Jing. Infrared and Visible Image Fusion Based on Multi-Scale Contrast Enhancement and Cross-Dimensional Interactive Attention Mechanism[J]. Infrared Technology , 2024, 46(7): 754-764. |
[3] | ZHAO Songpu, YANG Liping, ZHAO Xin, PENG Zhiyuan, LIANG Dongxing, LIANG Hongjun. Object Detection in Visible Light and Infrared Images Based on Adaptive Attention Mechanism[J]. Infrared Technology , 2024, 46(4): 443-451. |
[4] | HE Le, LI Zhongwei, LUO Cai, REN Peng, SUI Hao. Infrared and Visible Image Fusion Based on Dilated Convolution and Dual Attention Mechanism[J]. Infrared Technology , 2023, 45(7): 732-738. |
[5] | CHEN Xin. Infrared and Visible Image Fusion Using Double Attention Generative Adversarial Networks[J]. Infrared Technology , 2023, 45(6): 639-648. |
[6] | CHEN Yanlin, WANG Zhishe, SHAO Wenyu, YANG Fan, SUN Jing. Multi-scale Transformer Fusion Method for Infrared and Visible Images[J]. Infrared Technology , 2023, 45(3): 266-275. |
[7] | WANG Tianyuan, LUO Xiaoqing, ZHANG Zhancheng. Infrared and Visible Image Fusion Based on Self-attention Learning[J]. Infrared Technology , 2023, 45(2): 171-177. |
[8] | HUANG Linglin, LI Qiang, LU Jinzheng, HE Xianzhen, PENG Bo. Infrared and Visible Image Fusion Based on Multi-scale and Attention Model[J]. Infrared Technology , 2023, 45(2): 143-149. |
[9] | CHEN Da, HE Quancai, DI Erzhen, DENG Zaozhu. Application of Partial Differential Segmentation Model with Adaptive Weight in Infrared Image of Substation Equipment[J]. Infrared Technology , 2022, 44(2): 179-188. |
[10] | WU Yuanyuan, WANG Zhishe, WANG Junyao, SHAO Wenyu, CHEN Yanlin. Infrared and Visible Image Fusion Using Attention- Based Generative Adversarial Networks[J]. Infrared Technology , 2022, 44(2): 170-178. |
1. |
杨晓超,郝慧良. 矿用电缆放电监测系统研究设计. 中国煤炭. 2024(S1): 406-410 .
![]() |