Citation: | LI Dexiang, GONG Xiaoxia, ZHANG Lixia, YUAN Jun, YANG Wenyun. Surface Quality of InSb Wafer Using Different Polishing Methods[J]. Infrared Technology , 2022, 44(1): 85-88. |
[1] |
Micklethwaite W F H. Bulk Growth of InSb and Related Ternary Alloy, in Bulk Crystal Growth of Electronic, Optical & Optoelectronic Materials[M]. Chichester: John Wiley & Sons, 2005.
|
[2] |
Hamidreza S. Optimisation of Cooled InSb Detectors[J]. Ⅲ-Ⅴ s Review, 2004, 17(7): 27-31.
|
[3] |
肖钰, 李家发, 王淑艳, 等. 锑化铟焦平面器件背面减薄后的表面处理方法研究[J]. 红外, 2020, 41(6): 7-11. DOI: 10.3969/j.issn.1672-8785.2020.06.002
XIAO Yu, LI Jiafa, WANG Shuyan, et al. Study on Surface Treatment Method of InSb Focal Plane Device After Backside Thinning[J]. Infrared, 2020, 41(6): 7-11. DOI: 10.3969/j.issn.1672-8785.2020.06.002
|
[4] |
Oszwaldowski M, Berus T. Doping of InSb thin films with lead[J]. Journal of Physics and Chemistry of Solids, 2000, 61(6): 875-885. DOI: 10.1016/S0022-3697(99)00405-9
|
[5] |
Wade T L, Vaidyanathan R, Happek U. Electrochemical formation of a Ⅲ-Ⅴ compcond semiconductor superlattice: InAs/InSb[J]. J. Electroanal Chem, 2001, 500(1-2): 322-332. DOI: 10.1016/S0022-0728(00)00473-3
|
[6] |
张伟, 刘玉岭, 孙薇, 等. 磨料和H2O2对InSb CMP效果影响的研究[J]. 半导体技术, 2008, 33(11): 1016-1019. DOI: 10.3969/j.issn.1003-353X.2008.11.020
ZHANG Wei, LIU Yuling, SUN Wei, et al. Study on the Influence of Abrasive and H2O2 on InSb CMP[J]. Semiconduct Technology, 2008, 33(11): 1016-1019. DOI: 10.3969/j.issn.1003-353X.2008.11.020
|
[7] |
宋晓岚, 刘宏燕, 杨海平, 等. 纳米SiO2浆料中半导体硅片的化学机械抛光速率及抛光原理[J]. 硅酸盐学报, 2008, 36(8): 1187-1194. DOI: 10.3321/j.issn:0454-5648.2008.08.031
SONG Xiaolan, LIU Hongyan, YANG Haiping, et al. Chemical Mechanical Polishing Removal Rate and Mechanism of Semiconducyor Silicon with Nano-SiO2 Slurries[J]. Journal of the Chinese Ceramic Society, 2008, 36(8): 1187-1194. DOI: 10.3321/j.issn:0454-5648.2008.08.031
|
[8] |
何英杰, 王海珍. 锑化铟的腐蚀特性研究[J]. 红外技术, 2011, 33(6): 323-327. DOI: 10.3969/j.issn.1001-8891.2011.06.003
HE Yingjie, WANG Haizhen. Study on Wet Etching Characteristic of InSbWafer[J]. Infrared Technology, 2011, 33(6): 323-327. DOI: 10.3969/j.issn.1001-8891.2011.06.003
|
[9] |
曹凌霞, 李玉峰. InSb表面的损伤层研究[J]. 中国宇航学会, 2003, 33(6): 111-113. https://www.cnki.com.cn/Article/CJFDTOTAL-BDTX198602009.htm
CAO Lingxia, LI Yufeng. Study on Surface Damage of InSb[J]. Chinese Society of Astronautics, 2003, 33(6): 111-113. https://www.cnki.com.cn/Article/CJFDTOTAL-BDTX198602009.htm
|
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