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Volume 44 Issue 9
Sep.  2022
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XU Lixia, LIU Lixia, YANG Yaodong, ZHOU Shuangfeng, ZHAO Haiquan, GAO Jing. Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing[J]. Infrared Technology , 2022, 44(9): 979-985.
Citation: XU Lixia, LIU Lixia, YANG Yaodong, ZHOU Shuangfeng, ZHAO Haiquan, GAO Jing. Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing[J]. Infrared Technology , 2022, 44(9): 979-985.
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Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing

  • Beijing Satellite Manufacturing Co., Beijing 100094, China

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  • Received Date: December 15, 2020
  • Revised Date: November 23, 2021
    Graphical Abstract
    • Abstract
  • Pseudo soldering with a normal appearance and electrical connections cannot be effectively detected by the existing detection technology. Pulse infrared detection technology was applied, and the trend that analyzes processes was adopted to establish the relationship between the degree of pseudo soldering and characteristic parameters of the infrared fitting curve. It is difficult to distinguish the background noise, and the signal of the pseudo soldering from excess temperature was successfully resolved. Results show that the resolution and signal-to-noise ratio were improved.
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    • References (9)
  • [1]
    李道明. 印制电路板制造中缺陷检测的研究[D]. 大连: 大连理工大学, 2015.

    LI Daoming. Research on Defect Detection in PCB Manufacturing[D]. Dalian: Dalian University of technology, 2015.
    [2]
    中国电子科技集团公司第三十八研究所. BGA芯片焊点缺陷逐点扫描测温检测方法[P]. CN201510793413.4. [2016-03-23].

    The 38th Research Institute of China Electronics Technology Group Corporation. BGA Chip Solder Joint Defect Point by Point Scanning Temperature Measurement Method[P]. CN201510793413.4. [2016-03-23].
    [3]
    谷振杰. 印制电路板焊点虚焊的红外热像特征提取[D]. 廊坊: 北华航天工业学院, 2019.

    GU Zhenjie, Infrared Thermal Image Feature Extraction of Solder Joint Defect of Printed Circuit Board[D]. Langfang: Beihua Institute Of Aerospace Technology, 2019.
    [4]
    周金龙. 基于脉冲涡流热成像的焊点缺陷检测及寿命预测[D]. 成都: 电子科技大学, 2016.

    ZHOU Jinlong, Solder Joint Defect Detection and Life Prediction Based on Pulse Eddy Current Thermal Imaging [D]. Chengdu: University of Electronic Science and Technology, 2016.
    [5]
    王付军. 电子元件焊接坏点红外图像检测仿真研究[J]. 计算机仿真, 2016, 6(33): 429-433. https://www.cnki.com.cn/Article/CJFDTOTAL-JSJZ201606095.htm

    WANG Fujun, Simulation Research on Infrared Image Detection of Welding Defects of Electronic Components[J]. Computer simulation, 2016, 6(33): 429-433. https://www.cnki.com.cn/Article/CJFDTOTAL-JSJZ201606095.htm
    [6]
    陶胜杰, 杨正伟, 田干, 等. 红外脉冲相位热像检测效率提高方法[J]. 红外与激光工程, 2016, 45(5): 39-45. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYJ201605007.htm

    TAO Shengjie, YANG Zhengwei, TIAN Gan, et al. Method for improving detection efficiency of infrared pulse phase thermal image[J]. Infrared and Laser Engineering, 2016, 45(5): 39-45. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYJ201605007.htm
    [7]
    ZHAO Xiangxi, ZHANG Wei, KONG Lingchao. Multi points temperature measurement of infrared scanning method on surface mount technology[C]//18th International Conference on Electronic Packaging Technology (ICEPT), 2017: 182-186.
    [8]
    LIU Junyan, TANG Qingju, WANG Yang. The study of inspection on SiC coated carbon–carbon composite with subsurface defects by lock-in thermography[J]. Composites Science and Technology, 2012, 72: 1240-1250. DOI: 10.1016/j.compscitech.2012.04.010
    [9]
    纪瑞东, 张旭刚, 王珏. 飞机复合材料构件的原位红外热成像检测[J]. 无损检测, 2016, 38(1): 13-16. https://www.cnki.com.cn/Article/CJFDTOTAL-WSJC201601005.htm

    JI Ruidong, ZHANG Xugang, WANG Jue. In situ infrared thermal imaging detection of aircraft composite components[J]. Nondestructive Testing, 2016, 38(1): 13-16. https://www.cnki.com.cn/Article/CJFDTOTAL-WSJC201601005.htm
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