张应旭, 李培源, 司洋, 姚亮亮, 赵鹏, 袁绶章, 殷慧, 李雄军. 基于微结构的红外焦平面芯片MTF测试[J]. 红外技术, 2024, 46(7): 821-825.
引用本文: 张应旭, 李培源, 司洋, 姚亮亮, 赵鹏, 袁绶章, 殷慧, 李雄军. 基于微结构的红外焦平面芯片MTF测试[J]. 红外技术, 2024, 46(7): 821-825.
ZHANG Yingxu, LI Peiyuan, SI Yang, YAO Liangliang, ZHAO Peng, YUAN Shouzhang, YIN Hui, LI Xiongjun. MTF Testing of Infrared Focal Plane Array Based on Microstructures[J]. Infrared Technology , 2024, 46(7): 821-825.
Citation: ZHANG Yingxu, LI Peiyuan, SI Yang, YAO Liangliang, ZHAO Peng, YUAN Shouzhang, YIN Hui, LI Xiongjun. MTF Testing of Infrared Focal Plane Array Based on Microstructures[J]. Infrared Technology , 2024, 46(7): 821-825.

基于微结构的红外焦平面芯片MTF测试

MTF Testing of Infrared Focal Plane Array Based on Microstructures

  • 摘要: 调制传递函数是用于评价红外焦平面芯片对不同空间频率目标成像能力的重要参数,焦平面芯片的调制传递函数受像元光敏面尺寸、中心距和载流子扩散长度的影响,随着像元中心距的减小,载流子扩散长度对调制传递函数的影响将更加明显。本文针对倒装互联结构焦平面芯片调制传递函数的测试需求,设计了一种方便、准确的调制传递函数测试方法,通过金属沉积、光刻等工艺在焦平面芯片表面制备特殊的微结构代替倾斜刀口,采用通用的红外焦平面测试系统获得了芯片的调制传递函数。测试结果显示采用该方法能准确方便地完成焦平面芯片的调制传递函数提取,便于焦平面芯片生产和研制单位快速地实现芯片的调制传递函数测试评价及工艺设计验证。

     

    Abstract: The modulation transfer function (MTF) is an important parameter for evaluating the imaging ability of an infrared focal plane (FPA) for targets with different spatial frequencies. The MTF of the focal plane is affected by the size of the photosensitive area of the pixel, center distance of the pixel, and carrier diffusion length. As the number of pixels decreases, the influence of the carrier diffusion length on the MTF becomes more evident. In this study, a convenient and accurate MTF testing method was designed to meet the requirements of MTF testing for hybrid FPA. A special microstructure was fabricated on the focal plane through metal deposition, photolithography, and other processes to replace the inclined knife edge. The MTF of the FPA was obtained by the proposed infrared focal-plane test method. The results demonstrate that the MTF of the FPA can be measured accurately and conveniently using this method, which is convenient for FPA production and development companies to evaluate the FPA performance and verify device fabrication quickly.

     

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