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单片晶圆气液混合流清洗技术研究

刘佰红 杨炜平 梁翔 杨丽丽 杜浩楠 保加兵 石春明 马跃霞 殷艳娥 段瑜

刘佰红, 杨炜平, 梁翔, 杨丽丽, 杜浩楠, 保加兵, 石春明, 马跃霞, 殷艳娥, 段瑜. 单片晶圆气液混合流清洗技术研究[J]. 红外技术, 2022, 44(12): 1332-1337.
引用本文: 刘佰红, 杨炜平, 梁翔, 杨丽丽, 杜浩楠, 保加兵, 石春明, 马跃霞, 殷艳娥, 段瑜. 单片晶圆气液混合流清洗技术研究[J]. 红外技术, 2022, 44(12): 1332-1337.
LIU Baihong, YANG Weiping, LIANG Xiang, YANG Lili, DU Haonan, BAO Jiabing, SHI Chunming, MA Yuexia, YIN Yane, DUAN Yu. Study on Dual-Fluid Spray Cleaning Technique for Single-wafer Particle Removal[J]. Infrared Technology , 2022, 44(12): 1332-1337.
Citation: LIU Baihong, YANG Weiping, LIANG Xiang, YANG Lili, DU Haonan, BAO Jiabing, SHI Chunming, MA Yuexia, YIN Yane, DUAN Yu. Study on Dual-Fluid Spray Cleaning Technique for Single-wafer Particle Removal[J]. Infrared Technology , 2022, 44(12): 1332-1337.

单片晶圆气液混合流清洗技术研究

详细信息
    作者简介:

    刘佰红(1989-),男,硕士,主要从事OLED器件制造工艺。E-mail:381944996@qq.com

  • 中图分类号: TN307.5

Study on Dual-Fluid Spray Cleaning Technique for Single-wafer Particle Removal

  • 摘要: 研究了气液混合流清洗方法对单片晶圆表面颗粒的去除效果,引入无量纲参数移径比(H/D)讨论其对单片晶圆表面颗粒去除效率的影响。此外,还讨论了冲洗时间、冲洗压力对颗粒去除效率的影响。结果表明:晶圆表面颗粒去除效率随着冲洗时间、冲洗压力的增大而提高。移径比为1时晶圆表面颗粒去除效率最高;当移径比小于1时,晶圆表面颗粒去除效率随移径比增大而提高;当移径比大于1时,晶圆表面开始出现未被冲洗的区域,颗粒去除效率随移径比增大而迅速降低。采用气液混合流清洗技术,可以实现颗粒直径为0.2~0.3 μm范围的颗粒去除效率达99%以上,颗粒直径为0.1~0.5 μm范围的颗粒去除效率达96%以上。
  • 图  1  气液混合流清洗示意图

    Figure  1.  Schematic of the dual-fluid spray cleaning system

    图  2  清洗前后晶圆表面颗粒测试分布

    Figure  2.  The particle distribution on the wafer surface was measured before and after cleaning

    图  3  清洗时间对颗粒去除效率的影响

    Figure  3.  The effects of spray time on the particle removal efficiency

    图  4  移径比对颗粒去除效率的影响

    Figure  4.  The effects of displacement-diameter ratio on the particle removal efficiency

    图  5  冲洗压力对颗粒去除效率的影响

    Figure  5.  The effects of nozzle injection pressure on the particle removal efficiency

    图  6  不同粒径颗粒去除效率

    Figure  6.  Particle removal efficiency with different particle sizes

    表  1  样品实验条件

    Table  1.   Experimental condition of samples

    Sample Spray time(nT) Displacement diameter ratio(H/D) Injection pressure/(Psi)
    a 1T 0.2 40
    b 2T 0.2 40
    c 3T 0.2 40
    d 4T 0.2 40
    e 4T 0.5 40
    f 4T 1 40
    g 4T 2 40
    h 4T 0.2 20
    i 4T 0.2 30
    j 4T 0.2 50
    下载: 导出CSV
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出版历程
  • 收稿日期:  2021-10-26
  • 修回日期:  2021-11-23
  • 刊出日期:  2022-12-20

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