中波红外640×512(25 μm)探测器组件可靠性验证试验

Reliability Verification Test of Mid-Wave Infrared 640×512(25 μm) Detector Assembly

  • 摘要: 随着红外探测器技术的发展,对探测器组件的可靠性提出了更高的要求。探测器可靠性随整机考核的方法难以满足考核需求,针对该问题,开展了中波红外640×512(25 μm)探测器组件在环境应力下的可靠性验证研究,对探测器组件中的关键部位进行了高温加速寿命试验、持续工作等试验,并根据关键部件专项可靠性试验数据对探测器组件的整体可靠性进行预计,结合所选择的可靠性评估方法,对试验结果进行评估,评估结果表明所研制的组件满足可靠性要求。所使用的可靠性验证及评估方法,可以对制冷型红外探测器组件做出较为客观、准确的评估。

     

    Abstract: The reliability requirements for detector assembly have increased significantly with the development of infrared detector technology. Traditional methods of assessing detector reliability along with the entire system are insufficient to meet these requirements. To address this issue, this paper investigates the reliability verification of a 640×512 (25 μm) mid-wave infrared detector module under environmental stress. Key components of the detector were subjected to high-temperature accelerated life tests and continuous operation tests. The overall reliability of the detector module was estimated based on the specialized reliability test data of critical components. The evaluation results, using selected reliability assessment methods, indicate that the developed module meets the reliability standards. The reliability verification and assessment methods used in this study provide an objective and accurate evaluation of the cooled infrared detector module.

     

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