基于微结构的红外焦平面芯片MTF测试

张应旭; 李培源; 司洋; 姚亮亮; 赵鹏; 袁绶章; 殷慧; 李雄军

基于微结构的红外焦平面芯片MTF测试

1.
昆明物理研究所, 云南昆明 650223
2.
陆军装备部驻重庆地区军事代表局驻昆明地区第一军代室, 云南昆明 650223

详细信息

作者简介:
张应旭（1992-），男，博士，工程师，主要从事红外探测器材料和器件及其可靠性的研究。E-mail: hopeyxzhang@buaa.edu.cn

通讯作者:
李雄军（1984-），男，博士，研究员，主要从事红外探测器材料与器件的研究。E-mail：lixiongjun666@126.com

中图分类号: TN219
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出版历程
- 收稿日期: 2023-03-28
- 修回日期: 2023-04-27
- 网络出版日期: 2024-07-24
- 刊出日期: 2024-07-19

MTF Testing of Infrared Focal Plane Array Based on Microstructures

1.
Kunming Institute of Physics, Kunming 650223, China
2.
No.1 Military Represnetative Office in Kunming of Military Represnetative Bureau of Army Equipment Department in Chongqing, Kunming 650223, China

摘要

摘要:
调制传递函数是用于评价红外焦平面芯片对不同空间频率目标成像能力的重要参数，焦平面芯片的调制传递函数受像元光敏面尺寸、中心距和载流子扩散长度的影响，随着像元中心距的减小，载流子扩散长度对调制传递函数的影响将更加明显。本文针对倒装互联结构焦平面芯片调制传递函数的测试需求，设计了一种方便、准确的调制传递函数测试方法，通过金属沉积、光刻等工艺在焦平面芯片表面制备特殊的微结构代替倾斜刀口，采用通用的红外焦平面测试系统获得了芯片的调制传递函数。测试结果显示采用该方法能准确方便地完成焦平面芯片的调制传递函数提取，便于焦平面芯片生产和研制单位快速地实现芯片的调制传递函数测试评价及工艺设计验证。
- 红外焦平面 /
- 调制传递函数 /
- 倾斜刀口法 /
- 微结构
Abstract:
The modulation transfer function (MTF) is an important parameter for evaluating the imaging ability of an infrared focal plane (FPA) for targets with different spatial frequencies. The MTF of the focal plane is affected by the size of the photosensitive area of the pixel, center distance of the pixel, and carrier diffusion length. As the number of pixels decreases, the influence of the carrier diffusion length on the MTF becomes more evident. In this study, a convenient and accurate MTF testing method was designed to meet the requirements of MTF testing for hybrid FPA. A special microstructure was fabricated on the focal plane through metal deposition, photolithography, and other processes to replace the inclined knife edge. The MTF of the FPA was obtained by the proposed infrared focal-plane test method. The results demonstrate that the MTF of the FPA can be measured accurately and conveniently using this method, which is convenient for FPA production and development companies to evaluate the FPA performance and verify device fabrication quickly.
- infrared focal plane /
- MTF /
- tilted edge method /
- microstructure

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图 1 刀口靶标测试MTF原理示意图

Figure 1. Measurement of MTF using a knife-edge target

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图 2 焦平面芯片MTF测试的微结构制备流程。(a)碲镉汞混成芯片；(b)沉积Cr和Au；(c)离子束刻蚀去除Au层；(d)Cr腐蚀液腐蚀残余的金属Cr

Figure 2. The microstructure fabrication process for the MTF test of chip. (a) HgCdTe FPA; (b) Depositing Cr and Au; (c) Removing the Au by ion beam etching; (d)Removing Cr by chemical corrosion

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图 3 制备得到的用于MTF测试的焦平面芯片

Figure 3. The prepared focal plane chip for MTF testing

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图 4 光刻倾斜刀口示意图

Figure 4. The diagram of inclined knife edge for lithographic

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图 5 带微结构的中波320×256（30 μm）焦平面芯片响应图

Figure 5. Response grayscale of a MWIR 320×256 (30 μm) FPA with microstructures

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图 6 带微结构的中波320×256（30 μm）焦平面芯片LSF

Figure 6. LSF of a MWIR 320×256 (30 μm) FPA with microstructures

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图 7 带微结构的中波320×256（30 μm）焦平面芯片MTF测试结果

Figure 7. MTF of a MWIR 320×256 (30 μm) FPA with microstructures

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图 8 带微结构的中波640×512（15 μm）焦平面芯片响应图

Figure 8. Response grayscale of a MWIR 640×512 (15 μm) FPA with microstructures

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图 9 带微结构的中波640×512（15 μm）焦平面芯片LSF

Figure 9. LSF of a MWIR 640×512 (15 μm) FPA with microstructures

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图 10 不同p型载流子浓度640×512中波红外焦平面芯片MTF测试结果

Figure 10. MTF of MWIR 640×512 FPA with different p-type carrier concentrations

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图 11 中波640×512（15 μm）焦平面芯片LSF比较

Figure 11. Comparison of LSF for MWIR 640×512 (15um) FPA

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参考文献(12)

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