Abstract: Non-cooled infrared detectors have seen rapid development in both military and civilian fields in recent years. This article systematically studies the void problem in the eutectic bonding technology of non-cooled infrared detectors, aiming to analyze the impact of voids on detector performance through simulation and experimental analysis, and to explore effective process parameters for reducing void rates. In the simulation part, the impact of voids of different sizes on the stress distribution of the detector under temperature cycling and mechanical shock environments is analyzed, finding that voids can lead to stress concentration, affecting the reliability of the detector. In the experimental part, the impact of parameters such as welding environment and solder thickness on void rate is studied by changing these parameters. Combining the results of simulation and experiments, this paper proposes an optimized eutectic bonding process scheme to improve the reliability of non-cooled infrared detectors.