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陈珏. 材料内部脱粘的红外无损检测[J]. 红外技术, 2001, 23(3): 39-42. DOI: 10.3969/j.issn.1001-8891.2001.03.011
引用本文: 陈珏. 材料内部脱粘的红外无损检测[J]. 红外技术, 2001, 23(3): 39-42. DOI: 10.3969/j.issn.1001-8891.2001.03.011
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Infrared Thermograph Testing and Heat Transfer Analysis Complex Material of Contained Delamination[J]. Infrared Technology , 2001, 23(3): 39-42. DOI: 10.3969/j.issn.1001-8891.2001.03.011
Citation: Infrared Thermograph Testing and Heat Transfer Analysis Complex Material of Contained Delamination[J]. Infrared Technology , 2001, 23(3): 39-42. DOI: 10.3969/j.issn.1001-8891.2001.03.011
shu

材料内部脱粘的红外无损检测

Infrared Thermograph Testing and Heat Transfer Analysis Complex Material of Contained Delamination

    摘要
  • 摘要: 根据传热学理论分析了内含缺陷和脱粘的材料表面温差,给出了键合硅片表面温差与缺陷的深度、厚度及加热时间之间关系的计算结果,介绍了利用红外热像仪检测材料内部脱粘的方法.

     

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