3D结构AlN MSM紫外探测器

3D AlN Metal-Semiconductor-Metal Structure UV Detector

  • 摘要: 为探究3D结构对基于AlN材料的MSM光电器件的性能提升,以AlN作为光吸收层材料,在传统的MSM光电器件基础上,对AlN层进行刻蚀,引入三维(three-dimensional,3D)结构,设计和制备了3D结构MSM器件(3D-MSM),并对不同刻蚀深度MSM器件的光电性能进行了测试和分析。根据测试结果,发现3D-MSM器件光电性能较MSM器件具有显著的提升,具体在刻蚀深度为1 μm的3D-MSM器件光响应度达到了8.2 mA/W,相较于MSM器件,光响应度提升了26.1%,光电流提升了52%,响应时间降低了26.7%。另外,采用3D结构器件阵列,实现了紫外探测器制备和测试,该器件阵列对不同形状图案都具有良好的成像功能。

     

    Abstract: To investigate the performance enhancement of AlN-based MSM photoelectric devices using three-dimensional (3D) structures with AlN as the light-absorption layer material, a 3D structure was introduced by etching the AlN layer based on the traditional MSM photoelectric device. A 3D-structured MSM device (3D-MSM) was designed and fabricated, and its photoelectric performance was tested and analyzed. According to the test results, the photoelectric performance of the 3D-MSM device was significantly better than that of the MSM device. Specifically, the 3D-MSM device with an etching depth of 1 μm achieved a photoresponsivity of 8.2 mA/W, which is a 26.1% increase in photoresponsivity, 52% increase in photocurrent, and 26.7% reduction compared with the MSM device. In addition, the 3D structure devices array was used to prepare and test the ultraviolet detectors, and the device array had good imaging functions for different shapes and patterns.

     

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