Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors
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引用本文: | 沈天铸. 红外焦平面探测器互连中的In缩球工艺[J]. 红外技术, 2007, 29(2): 96-98. doi: 10.3969/j.issn.1001-8891.2007.02.009 |
Citation: | Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors[J]. Infrared Technology , 2007, 29(2): 96-98. doi: 10.3969/j.issn.1001-8891.2007.02.009 |