非制冷红外探测器陶瓷封装结构优化及可靠性分析

刘继伟; 王金华; 孙俊伟; 胡汉林; 陈文礼

非制冷红外探测器陶瓷封装结构优化及可靠性分析

烟台艾睿光电科技有限公司, 山东烟台 264006

详细信息

作者简介:
刘继伟（1993-），男，硕士，研发工程师，研究方向为非制冷红外探测器封装设计。E-mail: ljw_1717@163.com

中图分类号: TN215
计量
- 文章访问数: 243
- HTML全文浏览量: 108
- PDF下载量: 84
- 被引次数: 0
出版历程
- 收稿日期: 2022-01-25
- 修回日期: 2022-03-18
- 刊出日期: 2023-01-20

Ceramic Package Structure Optimization and Reliability Analysis for Uncooled Infrared Detectors

Yantai Iray Technology Co., Ltd., Yantai 264006, China

摘要

摘要: 陶瓷封装是非制冷红外探测器最主流的封装形式，封装的低成本、小型化和高可靠性是发展方向。在某款陶瓷封装探测器结构的基础上，提出一种优化结构，优化后成本降低约5%、体积缩小约30%。基于ANSYS Workbench有限元分析软件，从网格数量无关性验证出发，分析了非制冷红外探测器陶瓷封装原始结构和优化结构各组件在10.2G随机振动环境和500g半正弦波冲击振动环境的最大等效应力和最大形变，结果显示两种结构均满足可靠性要求。在此基础上，本文对优化结构红外窗口的不同材料和不同厚度进行了500g半正弦波冲击振动环境可靠性仿真，结果表明：0.3 mm~1.0 mm厚度锗窗口和硅窗口均满足可靠性要求，最大等效应力和最大形变与窗口厚度呈负相关，相同厚度的红外窗口，硅窗口比锗窗口可靠性表现更好。本文的研究为非制冷红外探测器陶瓷封装形式的后续结构设计和仿真计算提供了参考。
- 非制冷红外探测器 /
- 有限元 /
- 陶瓷封装 /
- 结构优化 /
- 可靠性
Abstract: Ceramic packaging is the most common packaging form used for uncooled infrared detectors. The low cost, miniaturization, and high reliability of packaging are its key development directions. This paper proposes an optimized design that can reduce the cost and volume by nearly 5% and 30%, respectively, compared to an existing ceramic packaging structure. First, the independence of the grid number is proved. Then, the maximum equivalent stress and maximum deformation of each component of the original and optimized structures of the uncooled infrared detector ceramic packaging were analyzed under two conditions: a 10.2G random vibration and a 500g half-sine wave shock employing ANSYS Workbench. The results show that both structures meet the reliability requirements. In addition, reliability simulation for different materials and different thicknesses of the infrared window of the optimized structure was conducted under a 500g half-sine wave shock condition. The results show that both germanium and silicon windows with thicknesses from 0.3 mm to 1.0 mm meet the reliability requirements, and there is a negative correlation between the thickness of the window and maximum equivalent stress, as well as maximum deformation. For infrared windows with the same thickness, the reliability of the silicon infrared window was better. This study provides a reference for the subsequent structural design and simulation calculation of the ceramic packaging of an uncooled infrared detector.
- uncooled infrared detector /
- finite element /
- ceramic packaging /
- structural optimization /
- reliability

HTML全文

图 1 陶瓷探测器原始结构模型

Figure 1. Original structure model of ceramic detector

下载: 全尺寸图片幻灯片

图 2 陶瓷探测器优化结构模型

Figure 2. Optimized structure model of ceramic detector

下载: 全尺寸图片幻灯片

图 3 网格数量无关性验证

Figure 3. Grid number independence verification

下载: 全尺寸图片幻灯片

图 4 随机振动功率谱曲线

Figure 4. Random vibration power spectrum curve

下载: 全尺寸图片幻灯片

图 5 半正弦波形函数

Figure 5. Half sine waveform function

下载: 全尺寸图片幻灯片

图 6 随机振动环境计算结果

Figure 6. Results of random vibration environment calculation

下载: 全尺寸图片幻灯片

图 7 半正弦波冲击振动环境计算结果

Figure 7. Calculation results of half sine wave impact vibration environment

下载: 全尺寸图片幻灯片

图 8 半正弦波冲击振动环境对不同材料红外窗口的影响

Figure 8. Influence of half sinusoidal shock vibration environment on infrared windows of different materials

下载: 全尺寸图片幻灯片

表 1 某款陶瓷红外探测器优化前后各组件及整体尺寸参数

Table 1. The components and overall size parameters of a ceramic infrared detector before and after optimization

	Components	Size（l×w×h）/（mm×mm×mm）
Original structure	Windows	15.9×14.5×0.7
	Kovar	20.2×18.8×0.4
	Housing	22×22×2.9
	Overall size	22×22×8.03
Optimization structure	Windows	20.3×16.7×0.7
	Housing	22×19×2.9
	Overall size	22×19×6.45

下载: 导出CSV

表 2 各组件材料参数

Table 2. Material parameters of each component

Components	Density ρ/(g·cm^-3)	Poisson's ratio μ	Elasticity modulus E/GPa
Windows -Ge	5.3	0.3	130
Kovar	8.2	0.27	157
Housing	3.6	0.23	310
Chip	2.3	0.26	170
Pin	8.2	0.37	147

下载: 导出CSV

表 3 各组件随机振动计算结果

Table 3. Calculation results of random vibration of each component

	Components	Von mises stress -3σ/MPa	Deformation X-3σ/nm	Deformation Y-3σ/nm	Deformation Z-3σ/nm
Original structure	Windows	0.15	6.0	5.1	40
	Kovar	0.37	6.5	5.3	18
	Housing	0.41	4.7	0.37	8.3
	Chip	0.1	2.1	0.19	8.0
	Pin	1.0	1.2	0.75	1.4
Optimization structure	Windows	0.18	4.1	3.4	35
	Housing	0.49	3.3	2.7	9.1
	Chip	0.95	1.9	1.3	9.1
	Pin	0.94	1.1	0.54	0.84

下载: 导出CSV

参考文献(13)

[1]	Rogalski A, Martyniuk P, Kopytko M. Challenges of small-pixel infrared detectors: a review [J]. Reports on Progress in Physics, 2016, 79(4): 046501. doi: 10.1088/0034-4885/79/4/046501
[2]	Fisette B, Tremblay M, Oulachgar H, et al. Novel vacuum packaged 384×288 broadband bolometer FPA with enhanced absorption in 3-14μm wavelength[C]//SPIE Defense + Security, 2017: 101771R.
[3]	王强, 张有刚. 非制冷红外焦平面探测器封装技术研究进展[J]. 红外技术, 2018, 40(9): 837-842. http://hwjs.nvir.cn/article/id/hwjs201809002 WANG Q, ZHANG Y G. Research progress of the packaging techniques for uncooled infrared focal plane arrays[J]. Infrared Technology, 2018, 40(9): 837-842. http://hwjs.nvir.cn/article/id/hwjs201809002
[4]	Dumont G, Rabaud W, Yon J J, et al. Current progress on pixel level packaging for uncooled IRFPA[C]//Infrared Technology & Applications XXXVIII. International Society for Optics and Photonics, 2012: 83531I.
[5]	余黎静, 唐利斌, 杨文运, 等. 非制冷红外探测器研究进展(特邀)[J]. 红外与激光工程, 2021, 50(1): 71-85. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYJ202101010.htm YU L J, TANG L B, YANG W Y, et al. Research progress of uncooled infrared detectors(Invited) [J]. Infrared and Laser Engineering, 2021, 50(1): 71-85. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYJ202101010.htm
[6]	DRS. Products[EB/OL]. (2021-12-1)[2021-12-30]. https://www.leonardodrs.com/media/13691./2020_u6160_lcc_mr_2012-01-481_rev08.pdf.
[7]	Lynred. Products[EB/OL]. (2021-12-1)[2021-12-30]. https://lynred.com/products/pico640s.
[8]	LI T, ZUO Z X, LIAO R D. Meshing Method of high precision FEM in structural simulations [J]. Chinese Journal of Mechanical Engineering, 2009, 45(6): 304-308. doi: 10.3901/JME.2009.06.304
[9]	国防科学技术工业委员会. 军用设备环境试验方法冲击试验[S]. GJB150.18-86, 北京: 国防科学技术工业委员会军用标准化中心, 1986. National Defense Science, Technology and Industry Commission. Environmental test methods for military equipments--shock test[S]. GJB150. 18-86, Beijing: China--Military Standardization Center of national defense science, technology and Industry Commission, 1986.
[10]	中国人民解放军总装备部. 微电子器件试验方法和程序[S]. GJB 548B-2005, 北京: 总装备部军标出版发行部, 2005. The Chinese People's Liberation Army General Armaments Department. Test methods and procedures for microelectronic device[S]. GJB 548B-2005, Beijing: The Chinese People's Liberation Army General Armaments Department Military Standard Publication Distribution Department, 2005: 113-254.
[11]	Yazdi N. Silicon as a mechanical material[C]//Proceedings of the IEEE, 1982: 420-457.
[12]	AZOM. Supplier Data-Germanium (Ge) (Goodfellow)[EB/OL]. (2022-2-20)[2022-2-28]. https://www.azom.com/properties.aspx?ArticleID=1837.
[13]	卢健钊. 某星载天线的抗力学环境设计与动态性能分析[J]. 环境技术, 2021, 39(5): 6. https://www.cnki.com.cn/Article/CJFDTOTAL-HJJJ202105011.htm LU J Z. Design and dynamic properties analysis of a satellite -borne antenna under mechanical environment[J]. Environmental Technology, 2021, 39(5): 6. https://www.cnki.com.cn/Article/CJFDTOTAL-HJJJ202105011.htm