空间用红外探测器拼接技术研究

吕玮东; 邓旭光; 王乾威; 练敏隆; 张九双; 陈明; 顾德宇; 田大成

空间用红外探测器拼接技术研究

1.
北京空间机电研究所, 北京 100081
2.
32011部队, 北京 100081

详细信息

作者简介:
吕玮东（1990-），男，博士，研究方向是低温光学技术。E-mail: lvweidongcasc@163.com

中图分类号: TN219
计量
- 文章访问数: 246
- HTML全文浏览量: 89
- PDF下载量: 134
- 被引次数: 0
出版历程
- 收稿日期: 2022-07-17
- 修回日期: 2022-09-14
- 刊出日期: 2022-10-20

Infrared Detector Butted Technology for Space

1.
Beijing Institute of Space Mechanics & Electricity, Beijing 100081, China
2.
PLA No.32011, Beijing 100081, China

摘要

摘要: 随着空间遥感相机性能的不断提升，采用更大规模、更多谱段的红外焦平面阵列是未来航天用红外探测器的发展趋势，以满足相机大视场、高分辨率及多光谱探测的能力。目前，单探测器模块的研制受到探测器材料、硅读出电路加工工艺的限制，探测器规模、分辨率、谱段数量等指标无法满足使用要求。因此，通过机械拼接或光学拼接的方式制备大规模、多谱段红外焦平面阵列是必须的工程途经。本文对航天工程用大规模、多谱段红外探测器拼接方式进行了对比分析，给出了各种常见拼接方式的特点，总结了关键技术和核心指标。
- 大规模红外探测器 /
- 拼接技术 /
- 多光谱 /
- 读出电路
Abstract: To meet the demand for wide field of view, high-resolution, and multispectral detection in space applications, more large-scale bands and infrared focal plane arrays will be the future trend in space remote sensing. Currently, the scale and band of massive array detectors are limited by the sizes of detector materials and processing technology of silicon; thus, they are unable to meet the space requirements for wide field of view, high-resolution, and multispectral detection. Obtaining large-scale and multiband detectors through butting is a practical solution. In this paper, several butting techniques are discussed, and their properties, key technologies, and capabilities are presented.
- large-scale infrared detector /
- butted technology /
- multi-spectral /
- ROIC

HTML全文

图 1 红外探测器组件机械拼接原理

Figure 1. Mechanical splicing schematic diagram of infrared detector assembly

下载: 全尺寸图片幻灯片

图 2 红外探测器组件光学拼接原理图^[2]

Figure 2. Optical splicing schematic diagram of infrared detector assembly^[2]

下载: 全尺寸图片幻灯片

图 3 Raytheon公司探测器产品^[3-6]

Figure 3. Raytheon Corporation detector products^[3-6]

下载: 全尺寸图片幻灯片

图 4 Teledyne公司35个2k×2k碲镉汞拼接阵列^[8]

Figure 4. Teledyne Corporation 35 2k×2k HgCdTe detector arrays^[8]

下载: 全尺寸图片幻灯片

图 5 Selex公司8个HD1920×1080拼接阵列^[9]

Figure 5. Selex Corporation 8 HD1920×1080 detector arrays^[9]

下载: 全尺寸图片幻灯片

图 6 2048×16探测器拼接结构^[10]

Figure 6. 2048×16 detector splicing structure^[10]

下载: 全尺寸图片幻灯片

图 7 1500×1探测器拼接结构^[12]

Figure 7. 1500×1 detector splicing structure^[12]

下载: 全尺寸图片幻灯片

图 8 MTI焦平面组件结构^[13]

Figure 8. MTI focal plane assembly structure^[13]

下载: 全尺寸图片幻灯片

图 9 1500×2探测器拼接结构^[14]

Figure 9. 1500×2 detector splicing structure^[14]

下载: 全尺寸图片幻灯片

图 10 中电十一所探测器产品^[15]

Figure 10. NCRIEO Corporation detector products^[15]

下载: 全尺寸图片幻灯片

图 11 2048×1探测器拼接结构^[16]

Figure 11. 2048×1 detector splicing structure^[16]

下载: 全尺寸图片幻灯片

图 12 模块化封装探测器模块示意图

Figure 12. Schematic diagram of independent encapsulation module

下载: 全尺寸图片幻灯片

图 13 Raytheon公司ORION 2048×2048 InSb探测器^[17]

Figure 13. Raytheon Corporation ORION 2048×2048 InSb detector^[17]

下载: 全尺寸图片幻灯片

图 14 三边及四边可用于拼接结构^[9]

Figure 14. Three sides and four sides can be used for splicing structures^[9]

下载: 全尺寸图片幻灯片

图 15 公共基板作为引线与支撑^[18]

Figure 15. Common substrate as lead and support^[18]

下载: 全尺寸图片幻灯片

图 16 公共基板仅作为支撑^[18]

Figure 16. The common substrate serves only as support^[18]

下载: 全尺寸图片幻灯片

图 17 红外探测器结构

Figure 17. Infrared detector structure

下载: 全尺寸图片幻灯片

图 18 模块间的位置关系示意图

Figure 18. A diagram of the position between modules

下载: 全尺寸图片幻灯片

图 19 面阵两边、三边及四边用于拼接结构示意图^[19]

Figure 19. The two sides, three sides and four sides of the detector array are used for stitching the schematic diagram^[19]

下载: 全尺寸图片幻灯片

图 20 线列拼接重要边界示意图

Figure 20. Schematic diagram of linear array splicing of important boundaries

下载: 全尺寸图片幻灯片

图 21 模块化封装组成示意图^[20]

Figure 21. Schematic diagram of independent package composition^[20]

下载: 全尺寸图片幻灯片

图 22 面阵专用工装

Figure 22. Special tooling for focal plane array

下载: 全尺寸图片幻灯片

图 23 拼接工艺示意图

Figure 23. Schematic diagram of splicing process

下载: 全尺寸图片幻灯片

表 1 两种拼接特点对比

Table 1. Comparison of two butted technologies

Comparison projects	Optical butted	Mechanical butted
System complexity	Complex : Multiple relay optical systems Multiple sets of focal plane refrigerator components Multiple refrigeration controllers and video circuits	Simple : Relayless optical system 1 set of focal plane refrigerator components 1 set of refrigeration controller and video circuit
Requirements for optical system	Telecentric image space	None
Noise equivalent temperature difference	High	Low
Response consistency	Low	High
Focal plane butted accuracy	Structure/system assembled required, low accuracy	High
Focusing structure	Several sets	1 set

下载: 导出CSV

参考文献(24)

[1]	刘兆军, 周峰, 李瑜. 航天光学遥感器对红外探测器的需求分析[J]. 红外与激光工程, 2008, 37(1): 25-29. doi: 10.3969/j.issn.1007-2276.2008.01.005 LIU Z J, ZHOU F, LI Y. Demands analysis of IR detectors for space remote sensor[J]. Infrared and Laser Engineering, 2008, 37(1): 25-29. doi: 10.3969/j.issn.1007-2276.2008.01.005
[2]	邱民朴, 马文坡. 空间红外推扫成像系统探测器光学拼接方法[J]. 航天返回与遥感, 2019, 40(6): 51-58. doi: 10.3969/j.issn.1009-8518.2019.06.007 QIU M P, MA W P. Optical butting of linear infrared detector array for space pushbroom imaging systems[J]. Spacecraft Recovery and Remote Sensing, 2019, 40(6): 51-58. doi: 10.3969/j.issn.1009-8518.2019.06.007
[3]	Gert Finger, James W Beletic. Review of the state of infrared detectors for astronomy in retrospect of the June 2002 workshop on scientific detectors for astronomy[C]//Proc. of SPIE, 2003, 4841: 839-852.
[4]	Philippe Tnbolet, Philippe Chorier. Large infrared focal plane arrays for space applications[J/OL]. [2002-01]. https://www.researchgate.Net/publication/228975841_Large_Infrared_Focal_Plane_Arrays_for_Space_Applications.
[5]	Peter J Love, Alan W Hoffman, Ken J Ando, et al. 2K×2K HgCdTe detector arrays for VISTA and other applications[C]//Proc. of SPIE, 2004, 5499: 68-77.
[6]	Reinhold J Dorn, Gert Finger, Gotthard Huster, et al. The CRIRES InSb megapixel focal plane array detector mosaic[C]//Proc of SPIE, 2004, 5499: 510-517.
[7]	Hall D N B, Luppino G, Hodapp K W, et al. A 4K×4K HgCdTe astronomical camera enabled by the James Webb Space Telescope NIR detector development program[C]//Proc. of SPIE, 2004, 5499: 1-14.
[8]	Thomas Sprafke, James W Beletic. High-performance infrared focal plane arrays for space applications[J]. Optics and Photonics News, 2008, 19(6): 22-27. doi: 10.1364/OPN.19.6.000022
[9]	Thorne P, Gordon J, Hipwood L G, et al. 16 megapixel 12 μm array developments at Selex ES[C]//Proc. of SPIE, 2013, 8704: 87042M-1-87042M-9.
[10]	Tom Chuh, Markus Loose, David J Gulbransen, et al. Astronomy FPA advancements at Rockwell scientific[C]//Proc. of SPIE, 2006, 6265: 62652K-1-62652K-14.
[11]	M Zucker, I Pivnik, E Malkinson, et al. Long mid-wave infrared detector with time delayed integration[C]//Proc. of SPIE, 2003, 4820: 580-592.
[12]	Tribolet P, Chatard J P, Costa P, et al. Progress in HgCdTe homojunction infrared detectors[J]. Journal of Crystal Growth, 1998, 184-185: 1262-1271. doi: 10.1016/S0022-0248(97)00759-8
[13]	Robert W Besuner, Christopher J Bebek, Gunther M Haller, et al. A 260 megapixel visible/NIR mixed technology focal plane for space[C]//Proc. of SPIE, 2011, 8155: 81550D-1-81550D-14.
[14]	Michael Dahlin. Advanced focal plane array systems for next-generation scanning remote sensing instrument[C]// Proc. of SPIE, 2003, 4820: 406-417.
[15]	王成刚, 东海杰, 刘泽巍, 等. "高分五号"卫星多谱段集成TDI线列红外探测器[J]. 航天返回与遥感, 2018, 39(3): 80-84. doi: 10.3969/j.issn.1009-8518.2018.03.009 WANG C G, DONG H J, LIU Z W, et al. Development of multispectral TDI linear infrared detector for GF-5 satellite[J]. Spacecraft Recovery and Remote Sensing, 2018, 39(3): 80-84. doi: 10.3969/j.issn.1009-8518.2018.03.009
[16]	李言谨, 陈路, 胡晓宁, 等. 长波红外2048元线列碲镉汞焦平面器件[J]. 红外与毫米波学报, 2009, 28(2): 90-92. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYH200902003.htm LI Y J, CHEN L, HU X N, et al. Long-wave infrared 2048-elements linear HgCdTe focal plane array[J]. Journal of Infrared and Millimeter Waves, 2009, 28(2): 90-92. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYH200902003.htm
[17]	Alan W Hoffman, Elizabeth Corrales, Peter J Love, et al. 2K×2K InSb for astronomy[C]//Proc. of SPIE, 2004, 5499: 59-67.
[18]	王成刚, 东海杰. 超长线列碲镉汞红外探测器拼接方式对比分析[J]. 激光与红外, 2013, 43(8): 920-923. doi: 10.3969/j.issn.1001-5078.2013.08.016 WANG C G, DONG H J. Butted manner analysis of long linear infrared focal plane detectors of MCT[J]. Laser and Infrared, 2013, 43(8): 920-923. doi: 10.3969/j.issn.1001-5078.2013.08.016
[19]	Thorne P, Weller H, Hipwood L G. 12 μm pixel pitch development for 3-side buttable megapixel MW FPAs[C]//Proc. of SPIE, 2012, 8353: 83532J-1-83532J-9.
[20]	Peter J Love Alan, Hoffman W, David J Gulbransen, et al. Large-format 0.85-2.5 micron HgCdTe detector arrays for low-background applications [C]// Proceeding of SPIE, 2004, 5167: 134-142.
[21]	梅强, 曹学强, 张博文, 等. 空间光学相机焦面拼接热变形对图像配准影响[J]. 航天返回与遥感, 2021, 42(5): 31-38. https://www.cnki.com.cn/Article/CJFDTOTAL-HFYG202105005.htm MEI Q, CAO X Q, ZHANG B W, et al. Analysis of the effect of butting assembly thermal deformation on image registration[J]. Spacecraft Recovery and Remote Sensing, 2021, 42(5): 31-38. https://www.cnki.com.cn/Article/CJFDTOTAL-HFYG202105005.htm
[22]	郭楠, 于波, 夏晨晖, 等. 空间光学相机焦面拼接基座高温度稳定性控制[J]. 航天返回与遥感, 2020, 41(4): 64-73. https://www.cnki.com.cn/Article/CJFDTOTAL-HFYG202004009.htm GUO N, YU B, XIA C H, et. Temperature control with high stability for the assembly base of space optical cameras[J]. Spacecraft Recovery and Remote Sensing, 2020, 41(4): 64-73. https://www.cnki.com.cn/Article/CJFDTOTAL-HFYG202004009.htm
[23]	周峰, 刘冰, 王成刚, 等. 一种红外探测器超大面阵复合拼接方法: CN106813781A[P]. 2017. ZHOU F, LIU B, WANG C G, et. A Composite Splicing Method for Super Large Array of Infrared Detectors: CN106813781A[P]. 2017.
[24]	Rieke G H. NIRCam Detector Overview[EB/OL]. [2017-07-13]. https://jwst-docs.stsci.edu/jwst-near-infrared-camera/nircam-instrumentation/nir-cam-detector-overview.