对某型红外热像仪可靠性增长的研究与改进

王琦艺; 夏丽昆; 曾邦泽; 赵德利; 朱尤攀; 陈若童; 李广; 王若男

对某型红外热像仪可靠性增长的研究与改进

1.
昆明物理研究所, 云南昆明 650223
2.
陆军装备部驻重庆地区军事代表局驻昆明地区第一军事代表室, 云南昆明 650030

详细信息

作者简介:
王琦艺（1991-），女，硕士，工程师。主要研究方向：红外成像系统设计及相关技术。E-mail：wqy11wqy@163.com

通讯作者:
赵德利（1989-），男，硕士，副高级工程师。主要研究方向：红外成像系统设计及相关技术。E-mail：719554525@qq.com

中图分类号: TN216
计量
- 文章访问数: 422
- HTML全文浏览量: 58
- PDF下载量: 54
- 被引次数: 0
出版历程
- 收稿日期: 2021-10-19
- 修回日期: 2021-12-16
- 刊出日期: 2022-06-20

Research and Improvement on Reliability Growth of a Type of Infrared Thermal Imager

1.
Kunming Institute of Physics, Kunming 650223, China
2.
The First Representative Office in Kunming of the Department in Chongqing, Kunming 650030, China

摘要

摘要: 热像仪的可靠性水平会直接影响使用者任务成功率、维护成本及寿命周期，因此其可靠性设计工作越来越受到关注。同时，就目前国内热像仪研制情况而言，研制样机的可靠性并不能反映小批量生产产品的可靠性水平。因此，为充分反映研制样机的可靠性水平，本文主要研究了某型热像仪在研制过程中的可靠性增长方法，分析了红外热像仪的故障，建立了红外热像仪的任务可靠性模型，提出了相应的改进措施，并采用可靠性增长的办法来验证所提措施的有效性。本文所提改进措施满足装备试验鉴定要求，可实现热像仪的可靠性增长和批量产品可靠性不降低的目标。
- 红外热像仪 /
- 可靠性增长 /
- 平均无故障时间
Abstract: The reliability of thermal imagery has direct impact on the success rate of user tasks, maintenance costs and life cycle, so its reliability design is increasingly concerned. At the same time, as far as the development of thermal imagery in China is concerned, the reliability of the developed prototype does not reflect the reliability level of the products produced in small batches. Therefore, in order to fully reflect the reliability level of the developed prototype, this paper develops a method for certain infrared thermal imager that analyzes the feature of reliability growth in the development stage. We analyze the faults of the infrared thermal imaging camera, establish the mission reliability model of the infrared thermal imaging camera, propose corresponding improvement measures, and adopts the reliability to verify the effectiveness of the proposed measures. This method meets the requirements of equipment test and appraisal, and can achieve the goal of increasing the reliability of thermal imaging cameras and not reducing the reliability of batch products.
- infrared thermal imager /
- reliability growth /
- mean time between failures

HTML全文

图 1 任务可靠性框图

Figure 1. Block diagram of mission reliability

下载: 全尺寸图片幻灯片

图 2 热像视场故障

Figure 2. Fault diagram of thermal image field of view

下载: 全尺寸图片幻灯片

图 3 热像仪视场故障树图

Figure 3. Tree diagram of field of view fault of thermal imager

下载: 全尺寸图片幻灯片

图 4 电容磨至瓷体表面形貌结构图

Figure 4. Structure diagram of ceramic surface morphology after capacitive grinding

下载: 全尺寸图片幻灯片

图 5 电容内部电极层形貌结构图

Figure 5. Structure diagram of internal electrode layer morphology of capacitor

下载: 全尺寸图片幻灯片

图 6 电容内部结构

Figure 6. Internal structure diagram of capacitor

下载: 全尺寸图片幻灯片

图 7 杜安模型在线性坐标系中的增长曲线

Figure 7. Growth curve of Duane model in linear coordinate system

下载: 全尺寸图片幻灯片

表 1 预计结果

Table 1. Expected results

The name of the part	Estimated value
Infrared optical system	λ=20×10^-6/h； MTBF=50000 h
Detector assembly	λ=125×10^-6/h； MTBF=8000 h
Integrated processing circuit	λ=41.7×10^-6/h； MTBF=23980.8 h
Focusing zoom assembly	λ=100×10^-6/h MTBF=10000 h
Monoblock	λ=10×10^-6/h MTBF=100000 h

下载: 导出CSV

表 2 可靠性试验方案

Table 2. Test scheme for reliability verification

Scheme number	Developer risk α	User risk β	Test time θ₁	Number of judgement failures
Scheme number	Developer risk α	User risk β	Test time θ₁	Receive	Rejection
21	0.3	0.3	1.1	0	≥1

下载: 导出CSV

表 3 失效电容C93电性能测试数据表

Table 3. Electrical performance test data sheet of failure capacitor C93

Product Numbers	C/μF	DF	Insulation Resistance	Result
Capacitance C93 of product 1#	No data	No data	No reading	Short circuit failure
Note: Test instrument: agilent-4288a bridge; Test conditions: (1 ± 0.1) kHz, 1.0 ± 0.2 V

下载: 导出CSV

参考文献(15)

[1]	蔡毅, 王岭雪. 红外成像技术中的9个问题[J]. 红外技术, 2013, 35(11): 671-682. doi: 10.11846/j.issn.1001_8891.201311001 CAI Yi, WANG Linxue. Nine problems in infrared imaging technology[J]. Infrared Technology, 2013, 35(11): 671-682. doi: 10.11846/j.issn.1001_8891.201311001
[2]	王忆锋. 2013年的中国红外技术(上)[J]. 红外技术, 2014, 36(1): 10-21. http://hwjs.nvir.cn/article/id/hwjs201401002 WANG Yifeng. China's infrared technology in 2013 (Part I)[J]. Infrared Technology, 2014, 36(1): 10-21. http://hwjs.nvir.cn/article/id/hwjs201401002
[3]	中华人民共和国国家质量监督检验检疫总局. 通信设备用的光电子器件的可靠性通用要求: GB/T 21194-2007[S]. 北京: 中国标准出版社, 2007. General Administration of quality supervision, inspection and Quarantine of the people's Republic of China. General Requirements for Reliability of Optoelectronic Devices for Communication Equipment: GB/T 21194-2007[S]. Beijing: China Standards Press, 2007.
[4]	Xavier Breniere, Philippe Tribolet. IR detectors life cycle cost and reliability optimization for tactical applications[C]//Conference on Electro-Optical and Infrared Systems: Technology and Applications III, 2006: 43-47(doi: 10.1117/12.690381).
[5]	Xavier Breniere, Alain Manissadjian, Vuillermet M, et al. Reliability optimization for IR detectors with compact cryo-coolers[C]//Proc. of SPIE, 2005: 187-198(doi: 10.1117/12.607591).
[6]	MOLINA Marianne, BRENIERE Xavier. IR detectors dewar and assemblies for stringent environmental conditions[C]//Proc. of SPIE, 2007: 80-85(doi: 10.1117/12.721647).
[7]	陶亮, 赵劲松, 刘传明, 等. 高可靠性红外热像仪的设计方法[J]. 红外技术, 2014, 36(12): 941-948. http://hwjs.nvir.cn/article/id/hwjs201412001 TAO Liang, ZHAO Jinsong, LIU Chuanming, et al. Design method of high reliability thermal imager[J]. Infrared Technology, 2014, 36(12): 941-948. http://hwjs.nvir.cn/article/id/hwjs201412001
[8]	邓正杰. 军用电子测量仪器可靠性降额设计[J]. 电子质量, 2004(12): 49-51. https://www.cnki.com.cn/Article/CJFDTOTAL-DZZN20041200N.htm DENG Zhengjie. Design of Reducing Rating for military electronic measuring instruments reliability[J]. Electronic Quality, 2004(12): 49-51. https://www.cnki.com.cn/Article/CJFDTOTAL-DZZN20041200N.htm
[9]	埃贝灵, 康锐. 可靠性与维修性工程概论[M]. 北京: 清华大学出版社, 2010: 67-70. AI Beiling, KANG Rui. Introduction to Reliability and Maintainability Engineering[M]. Beijing: Tsinghua University Press, 2010: 67-70.
[10]	鲜飞. 通孔回流焊技术的研究[J]. 电子工业专用设备, 2006, 133: 58-60. https://www.cnki.com.cn/Article/CJFDTOTAL-DGZS200602015.htm XIAN Fei. The study on through hole reflow soldering technology[J]. Equipment for Electronic Products Manufacturing, 2006, 133: 58-60. https://www.cnki.com.cn/Article/CJFDTOTAL-DGZS200602015.htm
[11]	可靠性鉴定和验收试验: GJB 899A-2009[S]. 北京: 中国标准出版社, 2009. Reliability Testing for Qualification and Production Acceptance: GJB 899A-2009[S]. Beijing: China Standards Press, 2009.
[12]	刘眉存, 胡圣, 吴生虎. 电子元器件破坏性物理分析(DPA)综述[C]// 第十一届全国可靠性物理学术讨论会论文集, 2005: 12-18. LIU Meicun, HU Sheng, WU Shenghu. Summary of destructive physical analysis of electronic components (DPA)[C]//Proceedings of the 11th National Symposium on Reliability Physics, 2005: 12-18.
[13]	周源泉, 翁朝曦. 可靠性增长[M]. 北京: 科学出版社, 1992: 120-127. ZHOU Yuanquan, WENG Dawn. Reliability Growth[M]. Beijing: Science Press, 1992: 120-127.
[14]	梅文华. 可靠性增长试验[M]. 北京: 国防工业出版社, 2003: 132-134. MEI Wenhua. Reliability Growth Test[M]. Beijing: National Defense Industry Press, 2003: 132-134.
[15]	马兴元. 软件可靠性增长分析及其动态评估[D]. 哈尔滨: 哈尔滨理工大学, 2012. MA Xingyuan. Software Reliability Growth Analysis and Dynamic Evaluation[D]. Harbin: Harbin University of Technology, 2012.