留言板

尊敬的读者、作者、审稿人, 关于本刊的投稿、审稿、编辑和出版的任何问题, 您可以本页添加留言。我们将尽快给您答复。谢谢您的支持!

姓名
邮箱
手机号码
标题
留言内容
验证码

基于趋势分析法的虚焊缺陷热像数据处理技术

徐丽霞 刘丽霞 杨耀东 周双锋 赵海泉 高静

徐丽霞, 刘丽霞, 杨耀东, 周双锋, 赵海泉, 高静. 基于趋势分析法的虚焊缺陷热像数据处理技术[J]. 红外技术, 2022, 44(9): 979-985.
引用本文: 徐丽霞, 刘丽霞, 杨耀东, 周双锋, 赵海泉, 高静. 基于趋势分析法的虚焊缺陷热像数据处理技术[J]. 红外技术, 2022, 44(9): 979-985.
XU Lixia, LIU Lixia, YANG Yaodong, ZHOU Shuangfeng, ZHAO Haiquan, GAO Jing. Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing[J]. Infrared Technology , 2022, 44(9): 979-985.
Citation: XU Lixia, LIU Lixia, YANG Yaodong, ZHOU Shuangfeng, ZHAO Haiquan, GAO Jing. Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing[J]. Infrared Technology , 2022, 44(9): 979-985.

基于趋势分析法的虚焊缺陷热像数据处理技术

详细信息
    作者简介:

    徐丽霞(1986-),女,高级工程师,主要从事航天器结构红外热像、超声波无损检测技术研究。E-mail:xulixiabuaa@163.com

  • 中图分类号: TN219

Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing

  • 摘要: 针对现有检测手段难以解决的外观正常、又有电气连接的电子产品虚焊类缺陷的问题,本文采用脉冲红外热像检测方法获取温度数据,引入趋势分析法建立了虚焊类缺陷热像数据拟合曲线特征参量与不同虚焊程度缺陷之间的对应关系,成功解决了过余温度信号中难以辨识背景噪声和焊点缺陷信号的问题,提高了热像信号的分辨率和信噪比。
  • 图  1  红外热像自动化检测平台

    Figure  1.  The infrared thermography automatic detection platform

    图  2  焊点虚焊缺陷设计

    Figure  2.  Design drawing of pseudo soldering

    图  3  焊点模型示意图

    Figure  3.  Schematic diagram of solder joint model

    1− electron components(SMT); 2− Solder joint; 3− Pseudo soldering(Air void); 4−copper layer(pad & wire); 5− Circuit board(PCB)

    图  4  焊点热像原始图

    Figure  4.  Original thermal image of solder joint

    图  5  同一批次试验数据焊点温度随时间变化曲线

    Figure  5.  Time dependence curve of solder joint temperature of the same batch of experimental data

    图  6  温度变化程度异常的试验数据

    Figure  6.  Experimental data of abnormal temperature variation

    图  7  仿真数据降温段3阶至8阶多项式拟合结果

    Figure  7.  Third to eighth order polynomial fitting results of cooling section of simulation data

    图  8  对数五阶多项式拟合

    Figure  8.  Logarithmic fifth order polynomial fitting

    图  9  拟合降温速率最大值与虚焊程度散点图

    Figure  9.  Scatter diagram of fitting the maximum cooling rate and the degree of false welding

    图  10  不同时间点的正常焊点原始热像图

    Figure  10.  Original thermal image at normal solder joint

    图  11  不同时间点的虚焊焊点原始热像图

    Figure  11.  Original thermal image of pseudo solder joint at different time

    图  12  试验数据降温段3阶~8阶多项式拟合结果

    Figure  12.  Third to eighth order polynomial fitting results for cooling section of experimental data

    图  13  对数三阶多项式拟合

    Figure  13.  Fitting of logarithm third order polynomials

    图  14  拟合结果导数绝对值最大值与虚焊程度散点图

    Figure  14.  Scatter diagram of maximum absolute value of derivative of fitting results and false soldering degree

    表  1  仿真数据降温段3阶至8阶多项式拟合评价指标

    Table  1.   Evaluation index of third to eighth order polynomial fitting in cooling section of simulation data

    Fitting Order Sum of Squares of Errors(SSE) R-Square Root Mean Square(RMSE)
    3 1407.1 0.7753 2.6136
    4 1012.9 0.8375 2.2228
    5 762.77 0.8770 1.9337
    6 592.89 0.9039 1.7090
    7 470.74 0.9234 1.5266
    8 378.84 0.9380 1.3729
    下载: 导出CSV

    表  2  试验数据降温段3阶~8阶多项式拟合评价指标

    Table  2.   Evaluation index of third to eighth order polynomial fitting in cooling section of experimental data

    Fitting Order SSE R-Square RMSE
    3 1.5125 0.9897 0.1091
    4 0.4450 0.9970 0.0594
    5 0.1359 0.9991 0.0330
    6 0.0583 0.9996 0.0217
    7 0.0324 0.9998 0.0162
    8 0.0272 0.9998 0.0149
    下载: 导出CSV
  • [1] 李道明. 印制电路板制造中缺陷检测的研究[D]. 大连: 大连理工大学, 2015.

    LI Daoming. Research on Defect Detection in PCB Manufacturing[D]. Dalian: Dalian University of technology, 2015.
    [2] 中国电子科技集团公司第三十八研究所. BGA芯片焊点缺陷逐点扫描测温检测方法[P]. CN201510793413.4. [2016-03-23].

    The 38th Research Institute of China Electronics Technology Group Corporation. BGA Chip Solder Joint Defect Point by Point Scanning Temperature Measurement Method[P]. CN201510793413.4. [2016-03-23].
    [3] 谷振杰. 印制电路板焊点虚焊的红外热像特征提取[D]. 廊坊: 北华航天工业学院, 2019.

    GU Zhenjie, Infrared Thermal Image Feature Extraction of Solder Joint Defect of Printed Circuit Board[D]. Langfang: Beihua Institute Of Aerospace Technology, 2019.
    [4] 周金龙. 基于脉冲涡流热成像的焊点缺陷检测及寿命预测[D]. 成都: 电子科技大学, 2016.

    ZHOU Jinlong, Solder Joint Defect Detection and Life Prediction Based on Pulse Eddy Current Thermal Imaging [D]. Chengdu: University of Electronic Science and Technology, 2016.
    [5] 王付军. 电子元件焊接坏点红外图像检测仿真研究[J]. 计算机仿真, 2016, 6(33): 429-433. https://www.cnki.com.cn/Article/CJFDTOTAL-JSJZ201606095.htm

    WANG Fujun, Simulation Research on Infrared Image Detection of Welding Defects of Electronic Components[J]. Computer simulation, 2016, 6(33): 429-433. https://www.cnki.com.cn/Article/CJFDTOTAL-JSJZ201606095.htm
    [6] 陶胜杰, 杨正伟, 田干, 等. 红外脉冲相位热像检测效率提高方法[J]. 红外与激光工程, 2016, 45(5): 39-45. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYJ201605007.htm

    TAO Shengjie, YANG Zhengwei, TIAN Gan, et al. Method for improving detection efficiency of infrared pulse phase thermal image[J]. Infrared and Laser Engineering, 2016, 45(5): 39-45. https://www.cnki.com.cn/Article/CJFDTOTAL-HWYJ201605007.htm
    [7] ZHAO Xiangxi, ZHANG Wei, KONG Lingchao. Multi points temperature measurement of infrared scanning method on surface mount technology[C]//18th International Conference on Electronic Packaging Technology (ICEPT), 2017: 182-186.
    [8] LIU Junyan, TANG Qingju, WANG Yang. The study of inspection on SiC coated carbon–carbon composite with subsurface defects by lock-in thermography[J]. Composites Science and Technology, 2012, 72: 1240-1250. doi:  10.1016/j.compscitech.2012.04.010
    [9] 纪瑞东, 张旭刚, 王珏. 飞机复合材料构件的原位红外热成像检测[J]. 无损检测, 2016, 38(1): 13-16. https://www.cnki.com.cn/Article/CJFDTOTAL-WSJC201601005.htm

    JI Ruidong, ZHANG Xugang, WANG Jue. In situ infrared thermal imaging detection of aircraft composite components[J]. Nondestructive Testing, 2016, 38(1): 13-16. https://www.cnki.com.cn/Article/CJFDTOTAL-WSJC201601005.htm
  • 加载中
图(14) / 表(2)
计量
  • 文章访问数:  113
  • HTML全文浏览量:  29
  • PDF下载量:  17
  • 被引次数: 0
出版历程
  • 收稿日期:  2020-12-16
  • 修回日期:  2021-11-24
  • 刊出日期:  2022-09-20

目录

    /

    返回文章
    返回