Reliability Research for 640×512 Miniaturized IR Detector Dewar Assembly
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摘要: 在SWaP3(Size, Weight, and Power, Performance and Price)概念的驱使下,第三代制冷红外探测器向着高性能、小型化和轻量化的方向发展。作为军用核心电子元器件,制冷红外探测器的可靠性成为研究的重点。以浙江珏芯微电子有限公司所研制的640×512/15 μm小型化杜瓦组件为研究对象,开展了系统性的可靠性研究与试验,涉及到力学、热力学、多余物和真空寿命四个维度。经各项可靠性试验后,640×512/15 μm小型化杜瓦组件的性能保持良好,该结果表明此杜瓦组件在总体上具有较高的可靠性,能够满足常规军事应用需求。Abstract: Driven by the concept of SWaP3 (Size, Weight, and Power, Performance and Price), the development of the third-generation cooled IR detectors is proceeding in the direction of high performance, miniaturization, and light weight. As core military electronic devices, the reliability of IR detectors has become the focus of research. In this study, based on the 640×512/15 μm miniaturized dewar developed by Zhejiang Juexin Microelectronics Co., Ltd., a systematic reliability research is carried out. This research involves four dimensions, namely mechanics, thermodynamics, remainders, and vacuum. The performance of the 640×512/15 μm miniaturized dewar is evaluated through reliability tests. The results show that the miniaturized dewar has high reliability to satisfy most military needs.
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Key words:
- infrared detector /
- dewar assembly /
- miniaturize /
- reliability
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表 1 640×512小型化杜瓦组件试验前后芯片关键性能比较
Table 1. Main parameters comparison of 640×512 miniaturized dewar before and after test
Performance Parameter before test Parameter after test Number of total blind pixels 60 66 Blind pixel rate/% 0.018 0.020 Response non-uniformity/% 4.45 4.47 NETD/mK 13.74 13.92 -
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