某型红外热像仪结构改进设计研究

高有涛

某型红外热像仪结构改进设计研究

高有涛

华中光电技术研究所-武汉光电国家研究中心, 湖北武汉 430223

详细信息

作者简介:
高有涛（1979-），男，工程师，主要从事光电系统结构设计优化。E-mail：gaoyoutao17@126.com

中图分类号: TH745.1
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- PDF下载量: 90
- 被引次数: 0
出版历程
- 收稿日期: 2020-12-15
- 修回日期: 2021-01-12
- 刊出日期: 2022-02-20

Structural Improvement Design of an Infrared Thermal Imager

GAO Youtao

Huazhong Institute of Electro-Optics, Wuhan National Laboratory for Optoelectronics, Wuhan 430223, China

摘要

摘要: 红外热像仪机械环境可靠性是其结构设计最为重要的指标之一。为保证红外热像仪能够经受服役的振动环境，本文以某型红外热像仪故障闭环为契机开展失效机理及结构改进设计研究。基于动态试验结果对红外热像仪有限元模型进行修正。采用有限元数值方法和随机振动疲劳失效理论相结合对故障的产生机理进行了推测。根据分析结果重新对结构改进优化并通过疲劳失效理论和随机振动试验进行了验证。结果表明故障定位准确、提出的优化改进措施有效。本文的分析思路对单机传感器设计或故障定位、结构改进设计等具有一定参考意义。
- 红外热像仪 /
- 有限元方法 /
- 动态试验 /
- 随机振动 /
- 疲劳失效
Abstract: The mechanical environment reliability of infrared thermal imagers is one of the most important indices in its structural design. To ensure that the infrared thermal imager can withstand the vibration environment during operation, a fault closed loop of an infrared thermal imager is used as an example to develop research on the fault mechanism and structure improvement design. The finite-element model of the infrared thermal imager is modified based on the dynamic test. The fault mechanism is deduced by combining the finite-element method and the fatigue failure theory under random vibration. According to the analysis results, the structure was improved and verified using the fatigue failure theory and random vibration test. The results indicate that the fault location is accurate and the structural improvement is effective. The analysis method proposed in this paper is expected to provide a reference for the fault location and structural improvement of a single sensor.
- infrared thermal imager /
- finite element method /
- dynamic test /
- random vibration /
- fatigue failure

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图 1 红外热像仪结构模型（左）及安装面示意（右）

Figure 1. Sketch map of the model of infrared thermal imager(left) and the mounting surface(right)

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图 2 可靠性试验随机振动谱

Figure 2. The random vibration spectrum for reliability test

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图 3 探测器组动态测试结果

Figure 3. Dynamic test curve for detector

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图 4 探测器组第1阶模态振型

Figure 4. First mode shape of detector

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图 5 随机载荷条件下探测器组件等效应力云图

Figure 5. The equivalent stress plot of detector under the excitation of random vibration

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图 6 探测器组改进后结构

Figure 6. Detector structure after improved

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图 7 结构改进后第一阶模态振型

Figure 7. First mode shape of detector after improved

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图 8 结构改进后幅频响应曲线

Figure 8. Dynamic test curve for detector after improved

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图 9 结构改进后探测器组件等效应力云图

Figure 9. The equivalent stress plot of detector after structure improved

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图 10 改进前后插针根部加速度功率谱密度

Figure 10. Acceleration PSD of pin root before and after improved

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表 1 基于高斯分布的三区间法

Table 1. Three interval method based on Gauss distribution

Range of stress	Probability of occurrence	Number of cycles n
[−1σ, 1σ]	68.3%	0.683v_t⁺T
[(−2σ, −1σ)∪(1σ, 2σ)]	27.1%	0.271v_t⁺T
[(−3σ, −2σ)∪(2σ, 3σ)]	4.33%	0.043v_t⁺T
Total	99.73%	0.997v_t⁺T

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参考文献(11)

[1]	杨帆. 对某扫描型红外热像仪装调工艺的研究[D]. 西安: 西安电子科技大学, 2018. YANG Fan. Study on Alignment Technology of a Scanning Infrared Thermal Imager[D]. Xi'an: Xidian University, 2018.
[2]	蔡毅, 王岭雪. 红外成像技术中的9个问题[J]. 红外技术, 2013, 35(11): 671-682. doi: 10.11846/j.issn.1001_8891.201311001 CAI Yi, WANG Lingxue. Nine issues associated with infrared imaging technology[J]. Infrared Technology, 2013, 35(11): 671-682. doi: 10.11846/j.issn.1001_8891.201311001
[3]	王忆锋. 2013年的中国红外技术(上)[J]. 红外技术, 2014, 36(1): 10-21. http://hwjs.nvir.cn/article/id/hwjs201401002 WANG Yifeng. The infrared technology of China[J]. Infrared Technology, 2014, 36(1): 10-21. http://hwjs.nvir.cn/article/id/hwjs201401002
[4]	李颖文, 杨长城, 洪韬. 红外热像仪的自动MRTD测试和性能分析[J]. 红外与激光工程, 2010, 39: 287-290. https://cpfd.cnki.com.cn/Article/CPFDTOTAL-ZYHG201005001064.htm LI Yingwen, YANG Changcheng, HONG Tao. Automatic MRTD test and acquisition performance evaluation of infrared thermal imager[J]. Infrared and Laser Engineering, 2010, 39: 287-290. https://cpfd.cnki.com.cn/Article/CPFDTOTAL-ZYHG201005001064.htm
[5]	陶亮, 赵劲松, 刘传明, 等. 高可靠性红外热像仪的设计方法[J]. 红外技术, 2014, 36(12): 941-948. http://hwjs.nvir.cn/article/id/hwjs201412001 TAO Liang, ZHAO Jinsong, LIU Chuanming, et al. Design methods of high reliability thermal imagers[J]. Infrared Technology, 2014, 36(12): 941-948. http://hwjs.nvir.cn/article/id/hwjs201412001
[6]	丁继锋, 韩增尧, 马兴瑞. 航天器动力学模型试验验证技术研究进展[J]. 力学进展, 2012, 42(4): 395-405. https://www.cnki.com.cn/Article/CJFDTOTAL-LXJZ201204004.htm DING Jifeng, HAN Zengyao, MA Xingrui. Research evolution on the test verification of spacecraft dynamic model[J]. Advances in Mechanics, 2012, 42(4): 395-405. https://www.cnki.com.cn/Article/CJFDTOTAL-LXJZ201204004.htm
[7]	祝耀昌. 可靠性试验及其发展综述[J]. 航天器环境工程, 2007, 24(5): 261-270. https://www.cnki.com.cn/Article/CJFDTOTAL-HTHJ200705004.htm ZHU Yaochang. Reliability tests and their developments[J]. Spacecraft Environment Engineering, 2007, 24(5): 261-270. https://www.cnki.com.cn/Article/CJFDTOTAL-HTHJ200705004.htm
[8]	张力. 模态分析与实验[M]. 北京: 清华大学出版社, 2011. ZHANG Li. Modal Analysis and Experiment[M]. Beijing: Tsinghua University Press, 2011.
[9]	中国人民解放军总装备部. 可靠性鉴定和验收试验: GJB-899A-2009. [S]. 2009-05-25. The General Reserve Department of PLA. Reliability testing for qualification and production acceptance: GJB-899A-2009[S]. 2009-05-25.
[10]	张云, 吴圣陶, 曾柯杰, 等. 某电子设备随机振动疲劳寿命仿真分析[J]. 电子机械工程, 2016, 32(6): 25-28. https://www.cnki.com.cn/Article/CJFDTOTAL-DZJX201606006.htm ZHANG Yun, WU Shengtao, ZENG Kejie, et al. Analysis of random vibration fatigue life of a electronic equipment[J]. Electro Mechanical Engineering, 2016, 32(6): 25-28. https://www.cnki.com.cn/Article/CJFDTOTAL-DZJX201606006.htm
[11]	张忠明, 服部修次, 田川纪英, 等. 铜合金的疲劳寿命预测[J]. 材料热处理学报, 2005, 26(5): 76-79. https://www.cnki.com.cn/Article/CJFDTOTAL-JSCL200505018.htm ZHANG Zhongming, Shuji Hattori, Hidenori Maekawa, et al. Prediciton of fatigue life for copper alloys[J]. Transactions of Materials and Heat Treatment, 2005, 26(5): 76-79. https://www.cnki.com.cn/Article/CJFDTOTAL-JSCL200505018.htm