[1]陈正超,沈 练,何 胤,等.红外探测器窗口异种材料焊接残余应力和变形分析[J].红外技术,2019,41(10):908-912.[doi:doi:10.11846/j.issn.1001_8891.201910003]
 CHEN Zhengchao,SHEN Lian,HE Yin,et al.Residual Stress and Deformation Analysis of Differential Material Welding in the Window of an Infrared Detector[J].Infrared Technology,2019,41(10):908-912.[doi:doi:10.11846/j.issn.1001_8891.201910003]
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红外探测器窗口异种材料焊接残余应力和变形分析
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《红外技术》[ISSN:1001-8891/CN:CN 53-1053/TN]

卷:
41卷
期数:
2019年第10期
页码:
908-912
栏目:
出版日期:
2019-10-21

文章信息/Info

Title:
Residual Stress and Deformation Analysis of Differential Material Welding in the Window of an Infrared Detector
文章编号:
1001-8891(2019)10-0908-05
作者:
陈正超沈 练何 胤彭雪蕾何江玲王 波何建豪李 冉徐世春
昆明物理研究所,云南 昆明 650223
Author(s):
CHEN ZhengchaoSHEN LianHE YinPENG XueleiHE JianglingWANG BoHE Jianhao LI RanXU Shichun
Kunming Institute of Physics, Kunming 650223, China
关键词:
红外探测器红外窗口热应力焊接变形有限元分析
Keywords:
infrared detector detector window thermal stress welding deformation finite element analysis
分类号:
TN215,TG404
DOI:
doi:10.11846/j.issn.1001_8891.201910003
文献标志码:
A
摘要:
平行平板光学零件焊接变形产生弥散斑影响会聚光束成像质量。用有限元法分析红外探测器窗口异种材料焊接界面的应力分布,根据Suhir双材料界面的弯矩平衡微分方程计算窗口弯矩分布,研究焊料厚度、不同焊料和被焊材料热膨胀失配对窗口变形的影响。在正交试验优化焊接工艺过程中,用激光干涉法检测窗口变形,检测结果表明窗片顶面的仿真计算变形曲面与实测轮廓曲面一致。材料热失配和钎焊料弹塑性是引起窗口变形的主要原因。
Abstract:
 The welding deformation of parallel plate optical parts produces defocused spots, which affect the imaging quality of the focused beam. In this study, a finite element analysis method was used to analyze the stress distribution of the welding interface of different materials in the window of an infrared detector. The bending moment was calculated based on the equilibrium differential equation of the Suhir theory of stresses as presented in bi-material strips. In addition, the effects of different solders, solder thicknesses, and thermal expansion mismatch on the deformation of the window were studied. In an orthogonal experiment to optimize the welding process, the deformation of the window was detected using laser interfer ometry. The simulated deformation of the top surface of the window agreed with the experimental results. Results also showed that the thermal mismatch of materials and elastic-plastic properties of the solders were the main causes of window deformation.

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备注/Memo

备注/Memo:
收稿日期:2018-11-27;修订日期:2018-12-12.
作者简介:陈正超(1987-),男,工程师,硕士,主要从事红外探测器杜瓦封装。E-mail:chenzhengchao2012@163.com。
更新日期/Last Update: 2019-10-22